Title:
FORCE SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/202821
Kind Code:
A1
Abstract:
The present invention makes it possible to obtain a highly sensitive force sensor having a small size. In this force sensor, a strain-sensing material is arranged on at least one surface section of a plate-shaped member, strain occurring in the plate-shaped member in response to force being applied to the surface section of the plate-shaped member is sensed by the strain-sensing material, and the force applied to the plate-shaped member is thereby sensed. The strain-sensing material is formed from a strip-shaped conductive material. The strain-sensing material is arranged on the surface section of the plate-shaped member so as to correspond to each of a first ring-shaped area serving as the center of a force application section in which force is applied to the surface section of the plate-shaped member and a second ring-shaped area at a different distance from the force application section than the first ring-shaped area.
Inventors:
NIWA EIJI (JP)
SUGIYAMA YOSHIHISA (JP)
SUZUKI KEN (JP)
SUGIYAMA YOSHIHISA (JP)
SUZUKI KEN (JP)
Application Number:
PCT/JP2020/005491
Publication Date:
October 08, 2020
Filing Date:
February 13, 2020
Export Citation:
Assignee:
RES INSTITUTE FOR ELECTROMAGNETIC MATERIALS (JP)
WACOM CO LTD (JP)
WACOM CO LTD (JP)
International Classes:
G01L1/22; G01L5/16
Domestic Patent References:
WO2018150994A1 | 2018-08-23 |
Foreign References:
DE10307978A1 | 2004-09-09 | |||
JPH08145767A | 1996-06-07 | |||
JPH0716132U | 1995-03-17 | |||
JP2014035239A | 2014-02-24 | |||
JPH10153499A | 1998-06-09 | |||
JP2018146309A | 2018-09-20 |
Attorney, Agent or Firm:
SATOH Masami et al. (JP)
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