Title:
FOREIGN BODY POLISHING METHOD AND FOREIGN BODY POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/111136
Kind Code:
A1
Abstract:
The disclosed foreign body polishing method involves creating information for capturing and correcting defects in the (work) surface of an array substrate (W), selecting a large foreign body (A) larger than a prescribed size from said information, partitioning the region containing the selected large foreign body (A) into multiple polishing areas (a), pressing against each polishing area (a) a polishing head for polishing until said polishing areas reach a prescribed height (h), and automatically moving to the next polishing area (a) for successive polishing and height measurements. Thus, even given large foreign bodies, polishing and correction are performed reliably and product quality is improved.
Inventors:
SATOH, Hitoshi (())
Application Number:
JP2010/006546
Publication Date:
September 15, 2011
Filing Date:
November 08, 2010
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
International Classes:
B24B21/00; B24B21/04; B24B27/033; B24B49/12
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (Osaka-Marubeni Bldg, 5-7 Hommachi 2-chome, Chuo-ku, Osaka-sh, Osaka 53, 〒5410053, JP)
Download PDF:
Claims:
Previous Patent: SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SAME
Next Patent: SEMICONDUCTOR DEVICE
Next Patent: SEMICONDUCTOR DEVICE