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Title:
FOREIGN MATERIAL REMOVING DEVICE, FOREIGN MATERIAL REMOVING SYSTEM, AND FOREIGN MATERIAL REMOVING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/216963
Kind Code:
A1
Abstract:
This foreign material removing device for removing a foreign material adhered to a substrate is provided with: a jetting unit that jets a gas toward a substrate portion having a width smaller than the full width of the substrate; a foreign material suction unit that sucks, with the foreign material, the gas jetted toward the substrate from the jetting unit; and a covering body that covers the portion to which the gas is to be jetted by means of the jetting unit.

Inventors:
YAMAZAKI, Ikushi (1 Takumicho, Sakai-ku, Sakai-sh, Osaka 22, 〒5908522, JP)
Application Number:
JP2016/068140
Publication Date:
December 21, 2017
Filing Date:
June 17, 2016
Export Citation:
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Assignee:
SAKAI DISPLAY PRODUCTS CORPORATION (1 Takumicho, Sakai-ku Sakai-sh, Osaka 22, 〒5908522, JP)
International Classes:
B08B5/00; B08B6/00
Domestic Patent References:
WO2011039972A12011-04-07
Foreign References:
JPH10290964A1998-11-04
JPS63267414A1988-11-04
JPH11114507A1999-04-27
JP2013193061A2013-09-30
JP2000107715A2000-04-18
JP2013084677A2013-05-09
Attorney, Agent or Firm:
KOHNO, Hideto et al. (KOHNO & KOHNO, 4-3 Tsuriganecho 2-chome, Chuo-ku, Osaka-sh, Osaka 35, 〒5400035, JP)
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