Title:
FOREIGN MATTER REMOVING MECHANISM, FLUID FLOW PROCESSING EQUIPMENT, AND FOREIGN MATTER REMOVING METHOD
Document Type and Number:
WIPO Patent Application WO/2003/010359
Kind Code:
A1
Abstract:
Fluid flow processing equipment, wherein plating solution (17) at the portion other than near a fluid level is prevented from flowing by a first partition plate (15) having a lower end fitted to the bottom part of a plating bath (11) and an upper end disposed at a portion lower than the fluid level to flow the plating solution (17) flowing through the bottom part of the plating bath (11) upward along the first partition plate (15), and heavy foreign matter is sunk and deposited near the lower end of the first partition plate (15) since the heavy foreign matter is difficult to go with such an upward flow and does not flow to the downstream side of the first partition plate, whereby the heavy foreign matter can be removed from the plating solution (17) without merely relying upon a filter (19) in a circulation pipe (10).
More Like This:
| JP7305075 | Plating equipment |
Inventors:
SHIMOYAMA AKIO (JP)
KODAMA KAZUSHI (JP)
KODAMA KAZUSHI (JP)
Application Number:
PCT/JP2002/007475
Publication Date:
February 06, 2003
Filing Date:
July 24, 2002
Export Citation:
Assignee:
SHARP KK (JP)
SHIMOYAMA AKIO (JP)
KODAMA KAZUSHI (JP)
SHIMOYAMA AKIO (JP)
KODAMA KAZUSHI (JP)
International Classes:
C25D21/00; C25D21/18; C25D7/12; (IPC1-7): C23G3/00; C25D21/00
Foreign References:
| JPH06280099A | 1994-10-04 |
Attorney, Agent or Firm:
Hara, Kenzo (Daiwa Minamimorimachi Building 2-6,
Tenjinbashi 2-chome Kita, Kita-k, Osaka-shi Osaka, JP)
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