Title:
FOREIGN OBJECT GRINDING METHOD AND FOREIGN OBJECT GRINDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/114399
Kind Code:
A1
Abstract:
A grinding head is lowered. Subsequently, with a large foreign object (A) (defect) being ground, the grinding head is moved, without being raised, along the large foreign object (A), in a state where a grinding tape feeding direction (d2) is brought into agreement with a grinding head movement direction (d1). Due to the above, with the grinding tape pressed by the grinding head against the large foreign object on the surface of a workpiece, this large foreign object is reliably corrected by being ground, in a short processing time.
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Inventors:
SATOH, Hitoshi (())
Application Number:
JP2010/006547
Publication Date:
September 22, 2011
Filing Date:
November 08, 2010
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
International Classes:
B24B21/00; B24B27/033; B24B49/12
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (Osaka-Marubeni Bldg, 5-7 Hommachi 2-chome, Chuo-ku, Osaka-sh, Osaka 53, 〒5410053, JP)
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Claims: