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Patent Searching and Data


Title:
FORMALDEHYDE FREE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/177110
Kind Code:
A1
Abstract:
A formaldehyde free adhesive composition and a plywood obtained by the adhesive composition is provided, and the plywood retains desired performances, such as water resistance and workability.

Inventors:
HU MINBIAO (CN)
SUN TONG (CN)
JIANG JINGUI (CN)
PAN SHI (CN)
FENG SHAOGUANG (CN)
ZHAI XUEMEI (CN)
Application Number:
PCT/CN2019/077265
Publication Date:
September 10, 2020
Filing Date:
March 07, 2019
Export Citation:
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Assignee:
DOW GLOBAL TECHNOLOGIES LLC (US)
DOW SILICONES CORP (US)
HU MINBIAO (CN)
SUN TONG (CN)
JIANG JINGUI (CN)
PAN SHI (CN)
FENG SHAOGUANG (CN)
ZHAI XUEMEI (CN)
International Classes:
C08L63/00; C08L33/08; C09J133/08; C09J163/00
Domestic Patent References:
WO2017112018A12017-06-29
Foreign References:
US5037700A1991-08-06
US5480720A1996-01-02
CN109071907A2018-12-21
CN102653623A2012-09-05
JP2005344084A2005-12-15
CN109251682A2019-01-22
Other References:
See also references of EP 3737715A4
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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