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Patent Searching and Data


Title:
FORMALDEHYDE-FREE MEDIUM AND HIGH-DENSITY BOARD SUPPORTING DEEP OVERCOATING AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/258682
Kind Code:
A1
Abstract:
A formaldehyde-free medium and high-density board supporting deep overcoating and a manufacturing method thereof. The manufacturing method comprises: chopping wood into wood chips, selecting, softening by steaming and boiling, defibering, sizing, drying and sorting, mat formation, prepressing, hot pressing, cooling, sanding, and warehousing inspection. Sizing is performed in two steps, comprising: firstly, using a lignin adhesive to perform primary sizing, performing water repellent treatment, and then using an MDI adhesive to perform secondary sizing. The manufacturing method uses a biomass adhesive and an aldehyde-free adhesive without adding additives such as a curing agent and a mildew prevention agent. Formaldehyde pollution is eliminated from the source by means of sizing performed in two steps, such that formaldehyde-free production is achieved, and a formaldehyde-free product is manufactured. Sequential control is performed in the sizing process, and the types and proportions of the adhesives are selected such that the hardness of the surface of a product is improved, and deep overcoating is possible on the final product.

Inventors:
SUN RUNCANG (CN)
YUAN TONGQI (CN)
CHEN XIAOLONG (CN)
WANG SUPENG (CN)
CHEN YUEYING (CN)
ZHOU XIANPENG (CN)
Application Number:
CN2019/118805
Publication Date:
December 30, 2020
Filing Date:
November 15, 2019
Export Citation:
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Assignee:
UNIV BEIJING FORESTRY (CN)
POWER DEKOR GROUP CO LTD (CN)
HUNAN FORESTECH NEW MAT CO LTD (CN)
International Classes:
B27N1/02; B27N3/00
Domestic Patent References:
WO2019068180A12019-04-11
Foreign References:
CN110281341A2019-09-27
CN101693378A2010-04-14
CN105150344A2015-12-16
CN104059598A2014-09-24
CN103358385A2013-10-23
US20170266930A12017-09-21
Attorney, Agent or Firm:
BEIJING DINGJIADA IP FIRM (CN)
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