Title:
FORMATION METHOD OF RESIN FILM AND DEPOSITION DEVICE OF RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2018/155421
Kind Code:
A1
Abstract:
This resin film formation method uses a mask with the mask main body formed from a metal material and having prescribed openings and forms a resin film on a substrate in a reduced pressure atmosphere, and involves: a first step in which a mask is provided contacting a substrate arranged on a cooled support base in a reduced pressure atmosphere, a gasified resin material is supplied through said mask and condensed on the substrate to form a liquid resin material film on the substrate; a second step in which the mask is separated from the substrate; a third step in which the resin material film on the mask is heat treated and said resin material film is evaporated; and a fourth step in which the resin material film remaining on the substrate is irradiated with UV light and the resin material film is cured to form the resin film.
Inventors:
AODAI MAKOTO (JP)
SEI KENSUKE (JP)
TAKAHASHI HIROHISA (JP)
SEI KENSUKE (JP)
TAKAHASHI HIROHISA (JP)
Application Number:
PCT/JP2018/005939
Publication Date:
August 30, 2018
Filing Date:
February 20, 2018
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
C23C14/04; B05B7/16; B05C9/12; B05C11/10; C23C14/12; H01L51/50; H05B33/04; H05B33/10
Domestic Patent References:
| WO2003085157A1 | 2003-10-16 |
Foreign References:
| JP4112702B2 | 2008-07-02 | |||
| JP2013129866A | 2013-07-04 | |||
| JP2016130347A | 2016-07-21 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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