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Patent Searching and Data


Title:
FORMED MICROCHANNEL HEAT EXCHANGER
Document Type and Number:
WIPO Patent Application WO/2011/126488
Kind Code:
A3
Abstract:
A heat exchanger (80) includes a plurality of heat exchange layers (95) stacked in a stackwise direction. Each of the layers includes a first plate (110) and a second plate (115), each of the first plate and the second plate includes a portion of a first enclosed header (120), a second enclosed header (125) and at least one flow channel (130) that extends between the first enclosed header and the second enclosed header. The first plate and the second plate are fixedly attached to one another to completely define the first enclosed header, the second enclosed header, and the at least one flow channel. An inlet header (85) is in fluid communication with the first enclosed header of each of the plurality of heat exchange layers (95) to direct a flow of fluid to the heat exchange layers. An outlet header is in fluid communication with the second enclosed header of each of the plurality of heat exchange layers to direct the flow of fluid from the heat exchange layers. The heat exchanger also includes a plurality of fins (100) with each positioned between adjacent heat exchange layers.

Inventors:
BERGH CHARLES J (US)
Application Number:
PCT/US2010/030462
Publication Date:
August 02, 2012
Filing Date:
April 09, 2010
Export Citation:
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Assignee:
INGERSOLL RAND CO (US)
BERGH CHARLES J (US)
International Classes:
F28D9/00; F28D1/03; F28F3/02; F28F9/02
Domestic Patent References:
WO2008060270A12008-05-22
WO2009139998A22009-11-19
WO2008003151A12008-01-10
Foreign References:
GB1277872A1972-06-14
US7044207B12006-05-16
US4966230A1990-10-30
GB2391296A2004-02-04
Attorney, Agent or Firm:
OTTERLEE, Thomas, J. (100 East Wisconsin Avenue Suite 330, Milwaukee WI, US)
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