Title:
FORMING THROUGH WAFER VIAS IN GLASS
Document Type and Number:
WIPO Patent Application WO/2015/038367
Kind Code:
A3
Abstract:
A method for forming through substrate vias (TSVs) in a non-conducting, glass substrate is disclosed. The method involves patterning a silicon template substrate with a plurality of lands and spaces, bonding a slab or wafer of glass to the template substrate, and melting the glass so that it flows into the spaces formed in the template substrate. The template substrate may then be removed to leave a plurality of TSVs in the glass slab or wafer.
Inventors:
GUDEMAN CHRISTOPHER (US)
SEN PROSENJIT (IN)
SEN PROSENJIT (IN)
Application Number:
PCT/US2014/053677
Publication Date:
May 07, 2015
Filing Date:
September 02, 2014
Export Citation:
Assignee:
INNOVATIVE MICRO TECHNOLOGY (US)
International Classes:
H01L23/00; H01L21/316; H01L23/10
Foreign References:
| US7416961B2 | 2008-08-26 | |||
| US20130050228A1 | 2013-02-28 | |||
| US20130119555A1 | 2013-05-16 | |||
| US20110217657A1 | 2011-09-08 | |||
| US20120318356A1 | 2012-12-20 |
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