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Title:
FREE-CUTTING COPPER ALLOY CASTING, AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY CASTING
Document Type and Number:
WIPO Patent Application WO/2020/261636
Kind Code:
A1
Abstract:
This copper allow casting comprises, 58.5-65.0 mass% (exclusive of 58.5 and 65.0) of Cu, 0.40-1.40 mass% (exclusive of 0.40 and 1.40) of Si, 0.002-0.25 mass% (exclusive of 0.002 and 0.25) of Pb, 0.003-0.19 mass% of P (exclusive of 0.003 and 0.19), 0.0001-0.100 mass% of Bi as an optional element, and the balance being Zn and inevitable impurities, wherein: the total amount of Fe, Mn, Co and Cr is less than 0.45 mass%; the total amount of Sn and Al is less than 0.45%; the relationship 56.0≤f1=[Cu]-5×[Si]+0.5×[Pb]+0.5×[Bi]-0.5×[P]≤59.5 is satisfied; the relationship 0.003

Inventors:
OISHI KEIICHIRO (JP)
SUZAKI KOUICHI (JP)
GOTO HIROKI (JP)
Application Number:
PCT/JP2020/006037
Publication Date:
December 30, 2020
Filing Date:
February 17, 2020
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/04; C22F1/08; C22F1/00
Domestic Patent References:
WO2013065830A12013-05-10
WO2006016630A12006-02-16
WO2015046421A12015-04-02
WO2009048008A12009-04-16
Foreign References:
JP2016194123A2016-11-17
US4259124A1981-03-31
JP2019116914A2019-07-18
JP2019130143A2019-08-08
JP2019141096A2019-08-29
JP2019163773A2019-09-26
JP2019048438W2019-12-11
JP2019048455W2019-12-11
JP2019050255W2019-12-23
JP2000119775A2000-04-25
JP2000119774A2000-04-25
JP2016511792W
JP2004263301A2004-09-24
JP2013104071A2013-05-30
JP2018048397A2018-03-29
JP2019508584W
US4055445A1977-10-25
JP2016194123A2016-11-17
Other References:
GENJIRO MIMAMASAHARU HASEGAWA, JOURNAL OF THE JAPAN COPPER AND BRASS RESEARCH ASSOCIATION, vol. 2, 1963, pages 62 - 77
"Basic and Industrial Technique of Copper and Copper Alloy (Revised Edition", 1994, JAPAN COPPER AND BRASS ASSOCIATION, pages: 533
"Metals Handbook", vol. 2, 1990, article "Properties and Selection: Nonferrous Alloys and Special-Purpose Materials", pages: 217 - 228
See also references of EP 3992321A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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