Title:
FREE-CUTTING COPPER ALLOY, AND MANUFACTURING METHOD OF FREE-CUTTING COPPER ALLOY
Document Type and Number:
WIPO Patent Application WO/2020/261611
Kind Code:
A1
Abstract:
This free-cutting copper alloy comprises Cu: 58.0%-65.0% exclusive, Si: 0.30%-1.30% exclusive, Pb: greater than 0.001% and less than or equal to 0.20%, Bi: greater than 0.020% and less than or equal to 0.10% and P: 0.001%-0.20% exclusive, the remainder being Zn and unavoidable impurities; the total of Fe, Mn, Co and Cr is less than 0.45%, the total of Sn and Al is less than 0.45%, 56.5 ≤ [Cu] - 4.7×[Si] + 0.5×[Pb] + 0.5×[Bi] - 0.5×[P] ≤ 59.5, 0.025 ≤ [Pb] + [Bi] < 0.25, 20 ≤ (α) < 85, 15 < (β) ≤ 80, 0 ≤ (γ) < 5, 8.0 ≤ ([Bi] + [Pb] - 0.002)1/2×10 + ([P] - 0.001)1/2×5 + ((β) - 7)1/2×([Si] - 0.1)1/2×1.2 + (γ)1/2×0.5 ≤ 17.0, 0.9 ≤ ([Bi] + [Pb] - 0.002)1/2×((β) - 7)1/2×([Si]-0.1)1/2 ≤ 4.0, and there are particles containing Bi present in the α phase.
Inventors:
OISHI KEIICHIRO (JP)
SUZAKI KOUICHI (JP)
GOTO HIROKI (JP)
SUZAKI KOUICHI (JP)
GOTO HIROKI (JP)
Application Number:
PCT/JP2019/050255
Publication Date:
December 30, 2020
Filing Date:
December 23, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/04; C22F1/00; C22F1/08
Domestic Patent References:
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Other References:
GENJIRO MIMAMASAHARU HASEGAWA, JOURNAL OF THE JAPAN COPPER AND BRASS RESEARCH ASSOCIATION, vol. 2, 1963, pages 62 - 77
"Basic and Industrial Technique of Copper and Copper Alloy", 1994, JAPAN COPPER AND BRASS ASSOCIATION, pages: 533
"Metals Handbook", vol. 2, 1990, ASM INTERNATIONAL, article "Properties and Selection: Nonferrous Alloys and Special-Purpose Materials", pages: 217 - 228
See also references of EP 3992316A4
"Basic and Industrial Technique of Copper and Copper Alloy", 1994, JAPAN COPPER AND BRASS ASSOCIATION, pages: 533
"Metals Handbook", vol. 2, 1990, ASM INTERNATIONAL, article "Properties and Selection: Nonferrous Alloys and Special-Purpose Materials", pages: 217 - 228
See also references of EP 3992316A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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