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Title:
FREE-CUTTING COPPER ALLOY AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY
Document Type and Number:
WIPO Patent Application WO/2018/034280
Kind Code:
A1
Abstract:
This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0 ≤ f0 = 100 × Sn/(Cu + Si + 0.5 × Pb + 0.5 × P – 75.5) ≤ 3.7, 78.5 ≤ f1 = Cu + 0.8 × Si – 8.5 × Sn + P + 0.5 × Pb ≤ 83.0, 61.8 ≤ f2 = Cu – 4.2 × Si – 0.5 × Sn – 2 × P ≤ 63.7. The surface area ratios (%) of the constituent phases satisfy the following relations, 36 ≤ κ ≤ 72, 0 ≤ γ ≤ 2.0, 0 ≤ β ≤ 0.5, 0 ≤ μ ≤ 2.0, 96.5 ≤ f3 = α + κ, 99.4 ≤ f4 = α + κ + γ + μ, 0 ≤ f5 = γ + μ ≤ 3.0, 38 ≤ f6 = κ + 6 × γ1/2 + 0.5 × μ ≤ 80. The long side of the γ phase does not exceed 50 μm, and the long side of the μ phase does not exceed 25 μm.

Inventors:
OISHI KEIICHIRO (JP)
SUZAKI KOUICHI (JP)
TANAKA SHINJI (JP)
GOTO YOSHIYUKI (JP)
Application Number:
PCT/JP2017/029369
Publication Date:
February 22, 2018
Filing Date:
August 15, 2017
Export Citation:
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Assignee:
MITSUBISHI SHINDO KK (JP)
International Classes:
C22C9/04; C22F1/08; C22F1/00
Domestic Patent References:
WO2015166998A12015-11-05
WO2013065830A12013-05-10
WO2008081947A12008-07-10
WO2007034571A12007-03-29
WO2006016442A12006-02-16
WO2006016624A12006-02-16
Foreign References:
JP2013104071A2013-05-30
JP2009509031A2009-03-05
JP2000119774A2000-04-25
JP2008516081A2008-05-15
JPH07508560A1995-09-21
JP2016159238A2016-09-05
JP2008214760A2008-09-18
JP2000119775A2000-04-25
JP2000119774A2000-04-25
JP2016511792A2016-04-21
JP2004263301A2004-09-24
US4055445A1977-10-25
Other References:
GENJIRO MIMA; MASAHARU HASEGAWA, JOURNAL OF THE JAPAN COPPER AND BRASS RESEARCH ASSOCIATION, vol. 2, 1963, pages 62 - 77
See also references of EP 3498869A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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