Title:
FREE-CUTTING COPPER ALLOY AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY
Document Type and Number:
WIPO Patent Application WO/2019/035224
Kind Code:
A1
Abstract:
This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relationships: 75.0≤f1=Cu+0.8×Si-7.5×Sn+P+0.5×Pb≤78.2; 60.0≤f2=Cu-4.8×Si-0.8×Sn-P+0.5×Pb≤61.5; and 0.09≤f3=P/Sn≤0.30. The area percentage (%) of respective constituent phases satisfies the following relationships: 30≤κ≤65; 0≤γ≤2.0; 0≤β≤0.3; 0≤μ≤2.0; 96.5≤f4=α+κ; 99.4≤f5=α+κ+γ+μ; 0≤f6=γ+μ≤3.0; and 35≤f7=1.05×κ+6×γ1/2+0.5×μ≤70. The κ phase is present within the α phase, the long side of the γ phase is at most 50 µm, and the long side of the μ phase is at most 25 µm.
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Inventors:
OISHI KEIICHIRO (JP)
SUZAKI KOUICHI (JP)
GOTO HIROKI (JP)
TANAKA SHINJI (JP)
SUZAKI KOUICHI (JP)
GOTO HIROKI (JP)
TANAKA SHINJI (JP)
Application Number:
PCT/JP2018/006203
Publication Date:
February 21, 2019
Filing Date:
February 21, 2018
Export Citation:
Assignee:
MITSUBISHI SHINDO KK (JP)
International Classes:
C22C9/04; C22F1/08; C22F1/00
Domestic Patent References:
| WO2013065830A1 | 2013-05-10 | |||
| WO2015166998A1 | 2015-11-05 |
Foreign References:
| JP2013104071A | 2013-05-30 | |||
| JP2009509031A | 2009-03-05 | |||
| JP2000119774A | 2000-04-25 | |||
| JPH07508560A | 1995-09-21 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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