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Title:
FREE-CUTTING COPPER ALLOY AND METHOD FOR MANUFACTURING FREE-CUTTING COPPER ALLOY
Document Type and Number:
WIPO Patent Application WO/2021/117528
Kind Code:
A1
Abstract:
A free-cutting copper alloy comprising more than 59.7% but less than 64.7% of Cu, more than 0.60% but less than 1.30% of Si, more than 0.001% but less than 0.20% of Pb, more than 0.001% but less than 0.10% of Bi, and more than 0.001% but less than 0.15% of P, the remaining portion being Zn and unavoidable impurities, wherein the total amount of Fe, Mn, Co, and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, 56.7≤Cu-4.7×Si+0.5×Pb+0.5×Bi-0.5×P≤59.7 and 0.003≤Pb+Bi<0.25 are satisfied, 0.02≤Bi/(Pb+Bi)≤0.98 is satisfied if 0.003≤Pb+Bi<0.08 is satisfied, 0.01≤Bi/(Pb+Bi)≤0.40 or 0.85≤Bi/(Pb+Bi)≤0.98 is satisfied if 0.08≤Pb+Bi<0.13 is satisfied, 0.01≤f3=Bi/(Pb+Bi)≤0.33 is satisfied if 0.13≤Pb+Bi<0.25 is satisfied, the metal structure of the alloy comprises an α phase and a β phase, and 17≤β≤75, 7.0≤(Bi+Pb-0.001)1/2×10+(P-0.001)1/2×5+(β-8)1/2×(Si-0.2)1/2×1.3≤16.0 are satisfied.

Inventors:
OISHI KEIICHIRO (JP)
SUZAKI KOUICHI (JP)
GOTO HIROKI (JP)
Application Number:
PCT/JP2020/044418
Publication Date:
June 17, 2021
Filing Date:
November 30, 2020
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/04; C22F1/08; C22F1/00
Domestic Patent References:
WO2013065830A12013-05-10
WO2006016630A12006-02-16
WO2009048008A12009-04-16
WO2008081947A12008-07-10
WO2007034571A12007-03-29
WO2012057055A12012-05-03
WO2019035225A12019-02-21
WO2005093108A12005-10-06
Foreign References:
JP2016194123A2016-11-17
JP2000355746A2000-12-26
JP2019048438W2019-12-11
JP2019048455W2019-12-11
JP2019050255W2019-12-23
JP2020006037W2020-02-17
JP2000119775A2000-04-25
JP2000119774A2000-04-25
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JP2013104071A2013-05-30
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JP2016194123A2016-11-17
Other References:
GENJIRO MIMAMASAHARU HASEGAWA, JOURNAL OF THE JAPAN COPPER AND BRASS RESEARCH ASSOCIATION, vol. 2, 1963, pages 62 - 77
See also references of EP 4074849A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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