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Patent Searching and Data


Title:
FRICTION MATERIAL, FRICTION MATERIAL COMPOSITION AND FRICTION MEMBER
Document Type and Number:
WIPO Patent Application WO/2019/150501
Kind Code:
A1
Abstract:
The present invention pertains to: a friction material which does not contain copper or when containing copper, contains an amount at which the copper element content constitutes no more than 0.5 mass%, the friction material also containing biosoluble inorganic fibers (X1) in an amount which constitutes at least 5.0 mass% and less than 10.0 mass%; and a friction material which does not contain copper or when containing copper, contains an amount at which the copper element content constitutes no more than 0.5 mass%, the friction material also containing inorganic fibers (X2) which contain calcium oxide and magnesium oxide and constitute at least 5.0 mass% and less than 10.0 mass%.

Inventors:
FUJIOKA, Osamu (9-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 06, 〒1006606, JP)
Application Number:
JP2018/003257
Publication Date:
August 08, 2019
Filing Date:
January 31, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL COMPANY, LTD. (9-2 Marunouchi 1-chome, Chiyoda-ku Tokyo, 06, 〒1006606, JP)
International Classes:
C09K3/14; F16D69/02
Domestic Patent References:
WO2012066969A12012-05-24
WO2014034878A12014-03-06
Foreign References:
JP2012255052A2012-12-27
JP2016079246A2016-05-16
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (OHTANI PATENT OFFICE, Toranomon ES Bldg. 7F. 25-2, Toranomon 3-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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