FRICTION STIR PROCESSING DEVICE AND FRICTION STIR PROCESSING METHOD

WIPO Patent Application WO/2012/133411

A1

Provided are a friction stir processing device and a friction stir processing method which are capable of good-quality friction stir processing regardless of the thickness, quality, and the like of a workpiece. A friction stir processing device (1) is provided with a tool (20) for friction stir processing workpieces (W1, W2), a processing head (7) which holds the tool (20) and can relatively move the tool in a processing direction while pressing the tool against the workpieces (W1, W2) while rotating the tool, a support table (3) for holding the workpieces (W1, W2), a cylinder unit (6) for supporting the support table (3) and biasing the support table (3) to the tool (20) side, and a load control means (61) for keeping pressure application force by which the tool (20) presses the workpieces (W1, W2) constant by performing control such that the biasing force of the cylinder unit (6) is kept constant. The friction stir processing device (1) is further provided with a tool height setting means (56) for setting the tool (20) at a preset height with respect to the workpieces (W1, W2).

OKI SACHIO (JP)
KAKEI KIICHI (JP)
HIRATA TOMOTAKE (JP)
TAKASUGI TAKAYUKI (JP)
KANENO YASUYUKI (JP)
MOCHIZUKI NOBORU (JP)
UCHIDA TAKANORI (JP)

PCT/JP2012/057939

October 04, 2012

March 27, 2012

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UNIV KINKI (JP)
PUBLIC UNIVERSITY CORP OSAKA PREFECTURE UNIVERSITY (JP)
ISEL CO LTD (JP)
OKI SACHIO (JP)
KAKEI KIICHI (JP)
HIRATA TOMOTAKE (JP)
TAKASUGI TAKAYUKI (JP)
KANENO YASUYUKI (JP)
MOCHIZUKI NOBORU (JP)
UCHIDA TAKANORI (JP)

B23K20/12

JP2002103061A	2002-04-09
JP2002153978A	2002-05-28
JP3261431B2	2002-03-04

MIYAZAKI Eiji et al. (JP)
Miyazaki Eiji (JP)

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