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Title:
FRP PRECURSOR, LAMINATED PLATE, METAL-CLAD LAMINATE, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/122820
Kind Code:
A1
Abstract:
Provided are: an FRP precursor which makes it possible to provide a metal-clad laminate exhibiting few light spots and little surface waviness, even when, for example, the thickness of the metal film thereof is 40μm or less; a laminated plate containing the FRP precursor; a metal-clad laminate having a metal foil on the laminated plate; a printed circuit board obtained by forming a circuit pattern on the metal-clad laminate; a semiconductor package that contains the printed circuit board; and a method for producing the same. The FRP precursor exhibits a surface waviness of 12μm or less on both surfaces thereof.

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Inventors:
TOSAKA YUJI (JP)
SAITOH TAKESHI (JP)
NAKAMURA YUKIO (JP)
SASAKI RYOHTA (JP)
SHIMIZU HIROSHI (JP)
Application Number:
PCT/JP2017/001134
Publication Date:
July 20, 2017
Filing Date:
January 13, 2017
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B29B11/16; B32B5/00; B32B15/08; H05K1/03; B29K101/10
Domestic Patent References:
WO2011024870A12011-03-03
Foreign References:
JPH11156851A1999-06-15
JP2013129827A2013-07-04
JP2007039495A2007-02-15
JP2004238465A2004-08-26
JP2010147443A2010-07-01
JP2004342871A2004-12-02
Other References:
See also references of EP 3403801A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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