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Patent Searching and Data


Title:
FULL ENCLOSED DIE FORGING METHOD, FULL ENCLOSED DIE FORGING APPARATUS, AND PRODUCT OF FORGING
Document Type and Number:
WIPO Patent Application WO/1999/007497
Kind Code:
A1
Abstract:
A full enclosed die forging method conducted by using a forging materiel which comprises crystal grains of different phases and has a recrystallization temperature of T1 and a melting point of T2. The method comprises enclosing the material within a mold and forging the material by punching in a temperature range from T1 to not higher than (T1+T2)/2, whereby the dynamic recrystallization of the material is promoted to produce a forging having a high plastic workability and a complicated shape.

Inventors:
NAKAMURA KATSUAKI (JP)
YOSHIJIMA TADASHI (JP)
YAMAUCHI ATSUSHI (JP)
SUGIMOTO RYOICHI (JP)
Application Number:
PCT/JP1998/003517
Publication Date:
February 18, 1999
Filing Date:
August 07, 1998
Export Citation:
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Assignee:
TOTO LTD (JP)
NAKAMURA KATSUAKI (JP)
YOSHIJIMA TADASHI (JP)
YAMAUCHI ATSUSHI (JP)
SUGIMOTO RYOICHI (JP)
International Classes:
B21J5/00; B21J1/06; B21J5/02; B21K1/14; B21K1/16; B21K21/06; C21D7/13; C22C9/04; C22F1/08; (IPC1-7): B21J1/06
Foreign References:
JPS5075155A1975-06-20
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