Title:
FUNCTIONAL ELEMENT PACKAGE AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/037221
Kind Code:
A1
Abstract:
This invention provides a functional element package that is resistant to lead-free
solder reflow and is low in cost. The functional element package comprises the
steps of applying a heat resistant film (2) to an element nonmounting side face
of a lead frame (1) on which a predetermined terminal pattern has been formed,
mounting a predetermined functional element (3) on the lead frame (1) on its element
mounting side face, providing a jetty part (5) for damming a liquid sealing resin
(6) around the functional element (3) on the lead frame (1), dropping a liquid
sealing resin (6) on the inner side of the jetty part (5), curing the liquid sealing
resin (6), separating the heat resistant film (2) from the lead frame (1), and
removing the jetty part (5) by cutting.
Inventors:
YONEDA YOSHIHIRO (JP)
ASADA TAKAHIRO (JP)
ASADA TAKAHIRO (JP)
Application Number:
PCT/JP2006/319040
Publication Date:
April 05, 2007
Filing Date:
September 26, 2006
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
YONEDA YOSHIHIRO (JP)
ASADA TAKAHIRO (JP)
YONEDA YOSHIHIRO (JP)
ASADA TAKAHIRO (JP)
International Classes:
H01L21/56; H01L23/12; H01L23/28; H01L23/50
Foreign References:
| JPH07221278A | 1995-08-18 | |||
| JP2005026260A | 2005-01-27 | |||
| JP2004349728A | 2004-12-09 | |||
| JPH09293806A | 1997-11-11 |
Attorney, Agent or Firm:
ABE, Hideki et al. (3F 1-2-18, Toranomo, Minato-ku Tokyo 01, JP)
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