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Patent Searching and Data


Title:
FUNCTIONAL PATTERN, SUBSTRATE PROVIDED WITH FUNCTIONAL PATTERN, AND METHOD FOR FORMING FUNCTIONAL PATTERN
Document Type and Number:
WIPO Patent Application WO/2016/080389
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a functional pattern, a substrate provided with a functional pattern, and a method for forming a functional pattern, whereby problems caused by variations in the concentration of a functional material in end parts of a mesh-shaped pattern can be reduced, and lead-out wiring suitable for space saving can be formed. The technical problem of the present invention is solved by the present invention formed by: a mesh-shaped pattern (6) obtained by causing a plurality of parallel-line patterns (3, 5) to intersect on a substrate, the parallel-line patterns (3, 5) each comprising two line segments parallel to each other obtained by applying lines of a liquid including a functional material on a substrate (1) to form liquid lines (2, 4) and drying the liquid lines, flow within the liquid lines being utilized to cause the functional material to accumulate at edge parts of the liquid lines; and a solid pattern (7) formed by applying the same functional material or a functional material having the same function as the functional material included in the mesh-shaped pattern on the substrate, the solid pattern (7) being formed so as to be superposed on at least a portion of the end parts of the mesh-shaped pattern.

Inventors:
YAMAUCHI MASAYOSHI (JP)
NIIZUMA NAOTO (JP)
OHYA HIDENOBU (JP)
Application Number:
PCT/JP2015/082253
Publication Date:
May 26, 2016
Filing Date:
November 17, 2015
Export Citation:
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Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B05D5/06; B05D5/12; H01B5/14; H05K1/02; H05K3/10
Domestic Patent References:
WO2014030647A12014-02-27
Foreign References:
JP2015012046A2015-01-19
JP2005152758A2005-06-16
JP2014123652A2014-07-03
Attorney, Agent or Firm:
MARUYAMA EIICHI (JP)
Maruyama Eiichi (JP)
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