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Patent Searching and Data


Title:
FUNCTIONAL SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/020819
Kind Code:
A1
Abstract:
The present invention relates to the technical field of electronic components, and provides a functional substrate and a manufacturing method therefor, and an electronic device. The functional substrate of the present invention comprises a first dielectric substrate; the first dielectric substrate comprises a first surface and a second surface disposed opposite to each other in the thickness direction of the first dielectric substrate; the first dielectric substrate is provided with a first connection hole; the first connection hole at least passes through the first surface; a first connection electrode is disposed in the first connection hole; the first connection hole comprises a first sub-hole and a second sub-hole which are sequentially arranged in a direction facing away from the second surface and communicated; the second sub-hole passes through the first surface; the opening width of the second sub-hole monotonically increases in the direction facing away from the second surface, and the minimum opening width of the second sub-hole is not less than the maximum opening width of the first sub-hole; and the connection position of the first sub-hole and the second sub-hole forms a corner.

Inventors:
AN QICHANG (CN)
WU YIFAN (CN)
XIAO YUELEI (CN)
LI YUE (CN)
FENG YULIN (CN)
LI HUIYING (CN)
LI BIQI (CN)
Application Number:
PCT/CN2022/108091
Publication Date:
February 01, 2024
Filing Date:
July 27, 2022
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
H01L27/01; H01L23/52
Foreign References:
US20080054486A12008-03-06
CN114520222A2022-05-20
CN1748299A2006-03-15
JPH08186111A1996-07-16
JPH0878525A1996-03-22
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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