Title:
FUSE ELEMENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/053090
Kind Code:
A1
Abstract:
This manufacturing method has the following steps: a chip positioning step (S1) in which a cylindrical low-melting-point metal chip is placed on a chip placement section of a main fuse-element body in which a chip engagement hole is formed so as to pass through said main fuse-element body; a chip pressure-bonding step (S2) in which the low-melting-point chip placed on the chip placement section is pressed into said chip placement section such that the edge of an opening in the low-melting-point chip bites into the inside of the chip engagement hole, provisionally affixing the low-melting-point chip to the chip placement section; and a chip welding step (S3) in which a high-temperature gas is fed to both the inside and the outside of the low-melting-point chip, welding the low-melting-point chip to the chip placement section.
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Inventors:
IWATA MASASHI (JP)
Application Number:
PCT/JP2014/075528
Publication Date:
April 16, 2015
Filing Date:
September 25, 2014
Export Citation:
Assignee:
YAZAKI CORP (JP)
International Classes:
H01H69/02; H01H85/11
Foreign References:
| JP2013073674A | 2013-04-22 | |||
| JPS63271842A | 1988-11-09 |
Attorney, Agent or Firm:
HONDA Hironori et al. (JP)
Hironori Honda (JP)
Hironori Honda (JP)
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