FUSE ELEMENT AND MANUFACTURING METHOD THEREFOR

Title:

FUSE ELEMENT AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2015/053092

Kind Code:

A1

Abstract:

This manufacturing method has the following steps: a chip positioning step (S1) in which a columnar low-melting-point metal chip is placed on a chip placement section of a main fuse-element body; a chip pressure-bonding step (S2) in which the low-melting-point chip placed on the chip placement section is pressed into said chip placement section such that part of the low-melting-point chip bites into a chip engagement hole in the chip placement section, resulting in a state in which the low-melting-point chip is provisionally affixed to the chip placement section, and a protrusion for the purposes of assessment is formed on the low-melting-point chip; and a chip welding step (S3) in which the provisionally affixed low-melting-point chip is welded to the chip placement section.

Inventors:

IWATA MASASHI (JP)

Application Number:

PCT/JP2014/075530

Publication Date:

April 16, 2015

Filing Date:

September 25, 2014

Export Citation:

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Assignee:

YAZAKI CORP (JP)

International Classes:

H01H69/02; H01H85/08; H01H85/11

Foreign References:

JP2013073674A	2013-04-22
JPH07223078A	1995-08-22