Title:
FUSE UNIT, MOLD STRUCTURE, AND MOLDING METHOD USING MOLD STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2011/158746
Kind Code:
A1
Abstract:
A mold structure (1) includes a fixed mold (4) and a movable mold (5) for burying, integrally with molding of a plastic molded article (26), a bus bar (3) in which a tuning-fork terminal (32) is provided on a main body circuit unit (31). When the fixed mold (4) and the movable mold (5) are joined together, the terminal base (40) of the tuning-fork terminal (32) is held between a terminal base receiving portion (13) of the fixed mold (4) and a terminal base abutting portion (17) of the movable mold (5) while the tuning-fork terminal (32) is projected outside a cavity which is formed in such a way that the mold main body portions of the fixed mold (4) and the movable mold (5) are joined each other and into the inside of which a resin is injected.
Inventors:
ONODA, Shinya (206-1, Nunohikibara, Makinohara-sh, Shizuoka 07, 〒4210407, JP)
Application Number:
JP2011/063348
Publication Date:
December 22, 2011
Filing Date:
June 10, 2011
Export Citation:
Assignee:
YAZAKI CORPORATION (4-28, Mita 1-chome Minato-k, Tokyo 73, 〒1080073, JP)
矢崎総業株式会社 (〒73 東京都港区三田１丁目４番２８号 Tokyo, 〒1080073, JP)
矢崎総業株式会社 (〒73 東京都港区三田１丁目４番２８号 Tokyo, 〒1080073, JP)
International Classes:
H01H85/045; H01H69/02; H01H85/175
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (Toranomon Kotohira Tower, 2-8 Toranomon 1-chome, Minato-k, Tokyo 01, 〒1050001, JP)
Download PDF:
Claims: