Title:
FUSIBLE MATERIAL FOR THREE-DIMENSIONAL MOLDING
Document Type and Number:
WIPO Patent Application WO/2018/021243
Kind Code:
A1
Abstract:
This fusible material for three-dimensional molding is used as a support material for supporting a three-dimensional object when manufacturing the three-dimensional object using a fused deposition modeling (FDM) 3D printer. The fusible material for three-dimensional molding contains a polyamide resin having: a hydrophilic monomer unit A having a hydrophilic group; a hydrophobic dicarboxylic acid monomer unit B; and a hydrophobic diamine monomer unit C, wherein the proportion of the hydrophilic monomer unit A with respect to the sum of all of the monomer units in the polyamide resin is at least 2.5 mol% and less than 13.5 mol%. This fusible material for three-dimensional molding is used as a support material and suitable for manufacturing a three-dimensional object by the FDM method, has moisture absorption resistance, has a high dissolution rate in neutral water, and can be quickly removed from a three-dimensional object precursor without using a strong alkali aqueous solution.
Inventors:
HIRAI JOUJI (JP)
YOSHIMURA TADANORI (JP)
YOSHIMURA TADANORI (JP)
Application Number:
PCT/JP2017/026700
Publication Date:
February 01, 2018
Filing Date:
July 24, 2017
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
C08G69/26; B29C67/00; B33Y10/00; B33Y70/00
Domestic Patent References:
| WO2016125860A1 | 2016-08-11 |
Foreign References:
| JP2016078284A | 2016-05-16 | |||
| JPS57167339A | 1982-10-15 | |||
| JPS5092996A | 1975-07-24 | |||
| JPH05210241A | 1993-08-20 | |||
| JPH07258407A | 1995-10-09 | |||
| JP2010159414A | 2010-07-22 | |||
| JP2007231087A | 2007-09-13 | |||
| JP2011518938A | 2011-06-30 | |||
| JP2015519456A | 2015-07-09 | |||
| JP2016501136A | 2016-01-18 |
Other References:
See also references of EP 3492511A4
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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