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Title:
GAMING CHIP AND METHOD OF MANUFACTURE
Document Type and Number:
WIPO Patent Application WO/2007/100945
Kind Code:
A3
Abstract:
A process of injection molding a gaming chip (20) around an RFID inlay (32). The RFID inlay (32) is placed in a mold (50) and plastic is injected around the RFID inlay. In an embodiment, the RFID inlay (32) includes a positioning surface (40) that may be positioned against another positioning surface (56) in an injection mold (50). As an example, the positioning surface (40) on a RFID inlay circuit board (38) may be a hole that extends through the circuit board, and the positioning surface (56) on the mold (50) may be a post that fits through the hole. The abutment of the positioning surfaces (40, 56) against one another prevents movement of the RFID inlay circuit board (38) during the injection molding process, and thus may be used to maintain the circuit board in the center of an injected gaming chip (20). In addition, if desired, additional posts (58) may be used to stabilize the RFID inlay circuit board (38) during the injection molding process.

Inventors:
JONES STEPHEN CRAIG (US)
RICHARD CHRISTIAN (CA)
MILLER RONALD N (CA)
Application Number:
PCT/US2007/061070
Publication Date:
November 06, 2008
Filing Date:
January 25, 2007
Export Citation:
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Assignee:
US PLAYING CARD CO (US)
JONES STEPHEN CRAIG (US)
RICHARD CHRISTIAN (CA)
MILLER RONALD N (CA)
International Classes:
G07F1/06; G07F1/00
Foreign References:
US6581747B12003-06-24
Attorney, Agent or Firm:
WYLIE, Roger, D. et al. (Two Embarcadero Center8th Floo, San Francisco CA, US)
Download PDF:
Claims:

WHAT IS CLAIMED IS:

1. A method of forming a gaming chip, comprising: placing a radio frequency identification inlay in a mold; and injection molding a polymer around the radio frequency identification inlay.

2. The method of claim 1, wherein: the radio frequency identification inlay comprises: a substrate; a semiconductor radio frequency identification die attached to the substrate; and a protective coating on the semiconductor radio frequency identification die; and injection molding comprises molding the polymer against the protective coating.

3. The method of claim 2, wherein the protective coating comprises a material that is compatible with the polymer .

4. The method of claim 2, wherein, during the injection molding process, the protective coating remains adhered to the semiconductor radio frequency identification die .

5. The method of claim 4, wherein the injection molding act occurs at or above 300 degrees Celsius.

6. The method of claim 2, wherein the protective coating comprises an epoxy glop top.

7. The method of claim 2, wherein the substrate comprises a circuit board with a glass transition temperature (Tg) below a temperature of the injection molding act, and a melting point above the temperature of the injection molding act.

8. The method of claim 1, further comprising supporting the radio frequency identification inlay in a center of a mold during the injection molding act.

9. The method of claim 1, further comprising limiting movement of the radio frequency identification inlay during the injection molding act.

10. A radio frequency identification inlay, comprising: a substrate; a semiconductor radio frequency identification die

attached to the substrate; and a protective coating on the semiconductor radio frequency identification die, the protective coating being arranged and configured protect the semiconductor radio frequency identification die during a high heat and high pressure injection molding process.

11. The inlay of claim 10, wherein the substrate comprises a circuit board with a glass transition temperature (Tg) below a temperature of the injection molding act, and a melting point above the temperature of the injection molding act.

12. The inlay of claim 10, wherein the protective coating covers the semiconductor radio frequency identification die, and connections of the semiconductor radio frequency identification die to the substrate.

13. The inlay of claim 12, wherein the protective coating encapsulates the semiconductor radio frequency identification die, and connections of the semiconductor radio frequency identification die to the substrate.

14. The inlay of claim 10, wherein the substrate comprises a first positioning surface for positioning

against a second positioning surface in an injection mold.

15. The inlay of claim 10, wherein the substrate comprises at least one opening therethrough.

16. The inlay of claim 10, wherein the semiconductor radio frequency identification die is attached to the substrate using a flip chip process.

17. The inlay of claim 10, wherein the protective coating is an encapsulating resin.

18. The inlay of claim 10, wherein the encapsulating resin comprises an epoxy glop top.

19. A gaming chip comprising the inlay of claim 10.

20. A gaming chip formed by injection molding and comprising the inlay of claim 10.

Description:

GAMING CHIP AND METHOD OF MANUFACTURE

REFERENCE TO RELATED APPLICATIONS

(0001) This application claims priority to U.S. provisional patent application serial Number 60/764,888, filed February 3, 2006, U.S. provisional patent application serial Number 60/773,228, filed February 14, 2006, and U.S. provisional patent application serial Number 60/773,103, filed February 14, 2006, all of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

(0002) Gaming chips, sometimes called "poker chips" or "casino chips," are commonly used in gambling establishments, such as casinos. The coin-type chips are used as currency to play games instead of cash.

(0003) Although the gaming chips work well as currency for casino games, because the chips are small, they are often easy to steal by casino employees. To prevent theft by employees and to track gambling habits of some of their customers, casinos have recently begun using gaming chips that incorporate electronic identification, such as radio frequency identification (RFID) . RFID permits a casino to very quickly evaluate a gaming chip to determine whether the gaming chip is authentic. Electronic security systems, including readers to read chips leaving a gambling

establishment, may be placed at entrances to the casino to monitor theft. In addition, readers may be provided at gaming tables so that gaming chips may be sensed and verified at the time a bet is placed.

(0004) In general, most gaming chips are either clay chips or plastic chips. Clay chips were originally made of clay, but for the last 75 years or so they have been made of a composition of materials heavier and more durable than clay. Real clay chips are compression molded under extreme pressure and temperature such as 10,000 pounds per square inch and 300 degrees Fahrenheit.

(0005) More recently, plastic chips have become popular. Plastic chips are injection molded and may include material to give them appropriate weight. In general, gaming chips weigh between approximately 6 to approximately 11-1/2 grams. Because many injection molded plastics are not heavy enough, for many plastic chips, a metal insert may be provided inside the chip, or a dopant of material, such as a lead or barium additive (e.g., barium sulfate), may be added to the plastic used in the injection process so as to add weight to the chip.

(0006) To provide RFID features in a plastic gaming chip, some prior art processes have incorporated a RFID tag into the chip. RFID tags are typically very fragile and delicate, and include a coil antenna and a microprocessor.

The injection molding process of contemporary plastic gaming chips is not conducive for the use of RFID tags in the molding process. The RFID tags may be damaged due to high temperatures and pressures used in the process and may be moved off center in a traditional injection molding process. This movement off center is a result of the thin and light nature of a RFID tag and the high pressure used in the injection molding process.

(0007) To address these problems, some prior art processes have placed RFID tags in protective sleeves or preforms so that a plastic chip may be molded around the protective sleeve or insert with the RFID tag protected by the sleeve or insert. For example, in PCT Application Publication No. WO 03/045661 Al, a tag circuit is placed in a preform and the preform is used in an insert-injection molding step.

SUMN[ARY OF THE INVENTION

(0008) The following presents a simplified summary of some embodiments of the invention in order to provide a basic understanding of the invention. This summary is not an extensive overview of the invention. It is not intended to identify key/critical elements of the invention or to delineate the scope of the invention. Its sole purpose is to present some embodiments of the invention in a simplified form as a prelude to the more detailed description that is presented later.

(0009) In accordance with an embodiment, a RFID inlay is incorporated into a gaming chip. A RFID inlay includes, for example, a patterned spiral inductive coupling loop or another antenna, and a semiconductor RFID die on a substrate, such as a printed circuit board.

(0010) In accordance with an embodiment, the RFID inlay includes an encapsulating material, such as a resin, that covers the semiconductor RFID die attached to the RFID inlay circuit board. The encapsulating material protects the semiconductor RFID die and the attachment of the semiconductor RFID die to the substrate so that the RFID inlay may be used in a high heat and high pressure injection molding process.

(0011) In accordance with an embodiment, the RFID inlay is placed in a mold and plastic is injected around the

RFID inlay. In an embodiment, the RFID inlay substrate, e.g., a circuit board, includes a positioning surface that may be positioned against another positioning surface in the injection mold. As an example, the positioning surface on the RFID inlay circuit board may be a hole that extends through the circuit board, and the positioning surface on the mold may be a post that fits through the hole. The abutment of the positioning surfaces against one another prevents or limits movement of the RFID inlay during the injection molding process, and thus may be used to maintain the circuit board in the center of a mold while the body of a gaming chip is injected around the circuit board. In addition, if desired, additional posts may be used to stabilize and align the RFID inlay during the injection molding process. Maintaining the RFID inlay at a center of the gaming chip equalizes stresses on opposite sides of the RFID inlay, preventing cupping or warping of the chip after injection. Thus, chips incorporating the RFID inlay are flat and stack well.

(0012) In accordance with an embodiment, the RFID inlay may include openings therethrough, allowing injected material to flow through the openings. Once the injected material is set, the hardened material extending through the openings aids in stabilizing the RFID inlay.

(0013) Other features of the invention will become apparent from the following detailed description when taken in conjunction with the drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

(0014) FIG. 1 is a top view of a gaming chip in accordance with an embodiment of the invention;

(0015) FIG. 2 is a top view of a RFID inlay for use in the gaming chip of FIG. 1 in accordance with an embodiment;

(0016) FIG. 3 is top view of a mold for use in forming a body piece of the gaming chip of FIG. 1;

(0017) FIG. 4 is a top view of more of the mold of FIG. 3, with three body pieces shown in place, and one opening in the mold shown empty;

(0018) FIG. 5 is a top view of a body formed by the mold of FIGS. 3 and 4;

(0019) FIG. 6 is a top view of second mold for forming an outer ring of the gaming chip of FIG. 1, with three body pieces shown in place, and one opening in the mold shown empty;

(0020) FIG. 7 is a top view, similar to FIG. 6, showing gaming chips formed in the mold of FIG. 6;

(0021) FIG. 8 is a top view of the gaming chip of FIG. 1, prior to a printed inlay being installed on the gaming chip;

(0022) FIG. 9 is a sectional view through a center of the gaming chip in FIG. 1;

(0023) FIG. 10 is a diagrammatic view of a top of a circuit board for the RFID inlay shown in FIG. 2 ;

(0024) FIG. 11 is a sectional view through the center of the RFID inlay in FIG. 2 ;

(0025) FIG. 12 is a diagrammatic view of a bottom of a RFID inlay in accordance with another embodiment; and

(0026) FIG. 13 is a sectional view through the center of the RFID inlay in FIG. 12.

DETAILED DESCRIPTION

(0027) In the following description, various embodiments of the present invention will be described. For purposes of explanation, specific configurations and details are set forth in order to provide a thorough understanding of the embodiments. However, it will also be apparent to one skilled in the art that the present invention may be practiced without the specific details. Furthermore, well- known features may be omitted or simplified in order not to obscure the embodiment being described.

(0028) Referring now to the drawings, in which like reference numerals represent like parts throughout the several views, FIG. 1 shows a gaming chip 20 in accordance with an embodiment of the invention. The gaming chip 20 shown in the drawings includes an outer ring 22. Edge spots 24 are spaced about an outer perimeter of the outer ring 22. A printed inlay 26 is positioned at the center of the gaming chip 20. A similar or different printed inlay (not shown) may be provided on an opposite side of the gaming chip. The pattern on the printed inlay may be selected by a purchaser, such as a casino.

(0029) In general, the invention is directed to an injection molding process in which a RFID inlay 32 (FIG. 2) is injection molded into a gaming chip, such as the gaming chip 20. The invention is also directed to the gaming chip

made in accordance with the process, and the RFID inlay.

(0030) A gaming chip in accordance with the invention, such as the gaming chip 20, may be produced with a number of different designs, and may or may not include a printed inlay 26 and/or edge spots 24. In addition, the edge spots 24 may be arranged in a different manner than the embodiment of the gaming chip 20 shown in the drawings.

(0031) The RFID inlay 32 provides RFID features in the gaming chip 20. Although described herein as utilizing RFID technology, other forms of electronic identification may be used. For RFID, the RFID device on the RFID inlay 32 may be, for example, an inductively coupled HF RFID inlay device, which is preferred for gaming chip applications. However, other types of RFID devices may be used, including, but not limited to, capacitively coupled RFID devices and UHF RFID devices.

(0032) Most conventional RFID inlays include a patterned spiral inductive coupling loop and a semiconductor RFID die mounted on a substrate. Typically, such RFID inlays utilize polyester film as a substrate, and adhesive to attach the RFID semiconductor die to the substrate. However, the injection molding process of contemporary plastic gaming chips is not conducive for the use of such RFID inlays in the molding process. The RFID inlays may be damaged due to high temperatures and pressures used in the

process, including melting of the adhesive used to hold RFID die in place, heat or pressure damage to the semiconductor RFID die, and/or damage to the substrate.

(0033) In addition, a conventional RFID inlay may be moved off center if placed in a mold cavity and used in a traditional injection molding process. This movement off center is a result of the thin and light nature of a RFID inlay and the high pressure used in the injection molding process .

(0034) To overcome these shortcomings of prior art RFID inlays, in an embodiment, the RFID inlay 32 is manufactured to withstand the heat of injection molding of a plastic gaming chip, such as the gaming chip 20. As an example, injection molding may occur at temperatures up to 600 degrees Fahrenheit, or even higher. In an embodiment, injection molding of the plastic material occurs at a temperature range between 480 and 600 degrees Fahrenheit, more often between 520 and 600 degrees Fahrenheit. In a preferred embodiment of an injection process, injection molding occurs at about 575 degrees Fahrenheit, but temperatures may vary in accordance with the resin materials and/or color pigments used in the injection process. As described below, the RFID inlay 32 is designed to withstand these temperatures.

(0035) In addition, in accordance with an

embodiment, the RFID inlay 32 is preferably of sufficient strength to withstand the pressures of injection molding. These pressures may range, for example, from 1400 to 2000 pounds per square inch, or even greater.

(0036) In accordance with an embodiment, the RFID inlay circuit board 38 is an FR4 epoxy glass circuit board with a thickness of approximately 22 mils (22 thousandths of an inch) . Other circuit boards may be used, but such circuit boards are preferably of a temperature durability and compressive strength that will survive the injection molding process. FR4 has a glass transition temperature

(Tg) well below the temperature of the injection molding process, but the melting point of FR4 is above the temperature of the injection molding process.

(0037) Because the melting point of FR4 is above the injection molding temperature and the amount of time that the RFID inlay is subjected to temperatures above FR4's Tg is short, FR4 maintains its structural integrity through the injection process. As is known, a material's Tg is the point above which the mechanical properties of the material begin to deteriorate. Printed circuit board materials change from hard, brittle substances to soft, rubber like substances after they reach their glass transition temperature. A RFID inlay circuit board 38 (e.g., FIG. 10) utilizing an FR4 epoxy glass circuit board in a thickness

described above will soften under the molding process temperatures described above, but will not liquify or vaporize. The circuit board 38 will harden again after the mold is cooled. The amount of time that the circuit board is held above Tg is minimal, and is believed by applicants to be between 2 and 5 seconds. This time is not sufficient for significant deterioration of the RFID inlay circuit board 38.

(0038) The RFID inlay 32 incorporates other technology to protect the components of the RFID inlay. In an embodiment, a RFID semiconductor die 33 (FIG. 11) is attached to the RFID inlay circuit board 38 using a flip chip process. As is known, flip chip microelectronic assembly is the direct electrical connection of face-down (hence, "flipped") electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. In contrast, wire bonding, an older technology, uses face-up chips with a wire connection to each pad. Flip chip is mechanically a more rugged interconnection method, and thus helps the RFID inlay 32 survive the injection process.

(0039) The RFID inlay circuit board 38 includes tracks that are gold plated or OLF protected. The tracks are not solder coated except in pad areas for flip chip bonding. These additional features protect the RFID inlay

circuit board 38 during the injection molding process.

(0040) In accordance with an embodiment, in the flip chip process, the RFID die 33 is attached to the RFID inlay circuit board 38 using a solder that is capable of withstanding higher temperatures than adhesives utilized in conventional RFID inlays. In an embodiment, the solder that is used is a tin and lead mix, or a silver and tin mix. Each of these solder mixes has a melting point above 200 degrees Celsius (392 degrees Fahrenheit) .

(0041) As can be understood, the injection molding temperatures described above exceed the melting temperature of the solders described in the previous paragraph. However, in accordance with an embodiment, a protective coating, such as an encapsulating resin 34 (FIG. 11), e.g., a glop top epoxy encapsulating resin, may be used for protecting the solder and the RFID semiconductor die 33. The encapsulating resin 34 is preferably applied over the RFID semiconductor die 33 in an amount sufficient to isolate and protect the soldered connection between the RFID semiconductor die 33 and the RFID inlay circuit board 38, and to protect the RFID semiconductor dye. As an example, the encapsulating resin 34 may be a temperature cured epoxy, black, with a Shore D hardness of at least 80. In an embodiment, such an encapsulating resin is applied 30 mils thick or less. In an embodiment, to apply the encapsulating

resin 34 at that thickness, the encapsulating resin is dispensed at medium viscosity.

(0042) Different protective coatings may be used. For example, a protective coating may be altered for variations in environmental stresses, such as temperature, shearing forces, and pressure produced by the injection molding process. For example, a protective coating may be implemented using either heat curable or UV curable compositions having a Shore D hardness value of at least 80, a linear shrinkage of less than 0.5%, and a glass transition temperature greater than 130 degrees Celsius. If the protective coating is too soft and the glass transition temperature too low, the molding material will press upon the die and cause damage. The protective coating is also configured to adhere to both the die 33 and the RFlO inlay circuit board 38 at 300° C. With regard to the thickness of the coating 34, the over-all thickness of the coating 34, the die 33, and the RFlO inlay circuit board 38 is approximately 50 mils or less. The protective coating 34 is also selected to be "compatible" with the plastic/polymer molding material in the sense that coating 34 is not absorbed into the plastic during the molding process. For example, an X-ray of a gaming chip will reveal an intact protective coating 34.

(0043) In one embodiment, the protective coating 34

may be implemented using an epoxy glob top commonly known as AMICON 5030LT. This coating is manufactured by Emerson Cummings and is characterized by Tg = 166° Celsius, Shore D hardness value = 94, and a linear shrinkage of approximately 0.47%. In yet another embodiment, protective coating 34 may be implemented using Dexter Hysol EO1072. As those of ordinary skill in the art will appreciate, any protective coating 34 suitable for protecting the die 33 and the solder/wire bond connection may be employed. In other embodiments, high temperature formulations having a glass transition temperature (Tg) of approximately 260° Celsius are employed.

(0044) The encapsulating resin 34 acts as a protective shield for the solder connections of the RFID semiconductor die 33 and the RFID inlay circuit board 38, as well as the RFID semiconductor die 33 itself. It is believed that the encapsulating resin 34 prevents temperatures at the solder and the RFID semiconductor die 33 from exceeding 200 degrees Celsius during the injection molding process. In addition, the encapsulating resin 34 absorbs the pressure of the injection process, protecting the RFID semiconductor die 33 and the solder connection. In an embodiment, without the encapsulating resin 34, a RFID semiconductor die, such as the RFID semiconductor die 33, may crack under pressures exceeding 4 N/mm 2 . The mold

pressure during the injection processes described above may be, for example, approximately 13.8 N/mm 2 . The encapsulating resin 34 protects the RFID semiconductor die 33 from reaching such pressures by providing a shield against direct contact with the high pressure injection. The encapsulating resin 34 also prevents the injected plastic from shearing the RFID semiconductor die 33 off its solder connections.

(0045) In an embodiment, the RFID inlay 32 includes an inductive coil 36 (FIG. 2) on the RFID inlay circuit board 38. Such inductive coils 36 are known in the art.

(0046) In an embodiment, the RFID inlay circuit board 38 is double-sided with a plated through hole 35

(FIG. 11) to complete a connection to the electromagnetic coil 36 for the RFID inlay 32.

(0047) An alternative embodiment of an RFID inlay 100 is shown in FIGS. 12 and 13. This alternate embodiment includes two amorphous soft magnetic ribbons 121 crossed at approximately 90 degrees. The ribbons 121 are in one embodiment 28 millimeters long, 1 millimeter wide, and approximately 40 micro inches thick. These ribbons 121 may be retained, for example, by an adhesive 123 (FIG. 13) in grooves 122 machined in the back of a printed inlay circuit board 138. The ribbons 121 may further be protected by a coat of solder mask 124 (FIG. 13) .

(0048) Electromagnetic strips such as the ribbons

121 are known, and may be a standard amorphous soft magnetic material. Alloy composition may be altered to provide a desired response wave form in a manner known in the art. For a gaming chip application, such as the gaming chip 20, the electromagnetic strips are preferably a length of at least 28 millimeters. In an embodiment, the ribbons 121 are used without a deactivator.

(0049) In accordance with an embodiment, the RFID inlay circuit board 38 and the RFID inlay circuit board 138 include flow holes 39 (e.g., FIG. 10) through portions of the circuit boards. These flow holes 39 serve to anchor the circuit boards in place after the injection molding process. That is, plastic from the injection molding process extends through and locks into the flow holes 39 after plastic hardening to lock the inlay circuit board in place.

(0050) In accordance with an embodiment, the inlay circuit board 38 includes a positioning surface for abutting against a structure within a mold. In the embodiment shown in the drawings, the positioning surface is a hole 40 that extends through the center of the inlay circuit board 38. Other positioning surfaces may be used, including, but not limited to, projections, indentations, or combinations of any of these.

(0051) The plastic formulation used in the injection process may be varied in accordance with a desired

composition of the gaming chip 20. In an embodiment, a polymer resin or a blend of polymer resins and their additives, color pigments, and/or heat stabilizers are dry blended together, for example, in a dry mixer. In an embodiment, a white formulation includes a resin formula of 18 percent nylon 6, supplied by I. P. G., and 82 percent barium 1 (barium sulfate), supplied by Kish Company. The pigment formula is 97.1 percent titanium dioxide, supplied by Dorsett and Jackson, 1.6 percent Kohnstamm blue, supplied by Kohnstamm Inc., and 1.3 percent PEP-Q supplied by Clariant Corporation.

(0052) These pigments and resins are mixed until they are homogenous. The compound is then fed into an extrusion process where it is melted, blended, and pressurized in an injection molding machine.

(0053) A mold 50 that may be used for a first injection molding process for forming the gaming chip 20 is shown in FIG. 3. The mold 50 is used to form a body piece 52, shown in FIG. 5.

(0054) The mold 50 includes a cavity 54 shaped like the body piece 52. The cavity 54 is connected to fluid flow channels 55 in the mold in a manner known in the art.

(0055) A center post 56 extends upward through the center of the cavity 54. Three support posts 58 extend out of the bottom of the opening and are spaced evenly from the

center post 56 .

(0056) The opposite mold half is shaped like the mold 50 shown in FIG. 3, but does not include the center post 56. As can be seen in FIG. 4, one of the RFID inlay circuit boards 38 is placed in the center of the cavity 54 for each of the positions in the mold at which the body pieces 52 are formed. In the embodiment shown in the drawing, the hole 40 extending through the center of the inlay circuit board 38 is positioned over and around the center post 56, and the remainder of the inlay circuit board 38 is supported by the support posts 58. When the opposite mold half presses down against the top of the mold half shown in FIG. 4, similar support posts 58 abut the opposite side of the inlay circuit board 38, thus supporting the inlay circuit board in position. In addition, the connection between the center post 56 and the hole 40 prevents lateral movement of the inlay circuit board 38.

(0057) A polymer material is injected into the mold 50. The polymer material flows into the cavity 54 and around the RFID inlay circuit board 38. The center post 56 prevents lateral movement of the inlay circuit board 38 during this injection process, and the support posts 58 maintain horizontal alignment of the inlay circuit board. After the injection process and a brief cooling period, the body piece 52 (FIG. 5) is removed from the mold 50. The

body piece 52 includes the edge spots 24 and an anterior portion which includes holes 62 where the support posts 58 extended against the RFID inlay circuit board 38.

(0058) After the body piece 52 has been formed, the body piece is positioned on an additional mold 70 (FIG. 6) . For each body piece 52, a cavity 72 is provided having an outer annular groove 74. During an injection process, a second polymer material (e.g., a different color than the polymer used to make the body piece 52) is injected into the area of this annular grove 74. The material in this additional process is typically a different color, and fills the spaces around the edge spots 24, forming the outer ring 22 for the gaming chip 20.

(0059) The polymer materials used for the second injection process may be similar to the first, but may be a different color. In an embodiment, the resin balance of 18 percent nylon 6 and 82 percent barium 1 remains the same, and the pigment formula changes slightly. In an embodiment, the pigment formula is 95.304 percent of the titanium dioxide described above, 3.52 percent of cadmium yellow provided by United Mineral, 1.03 percent cadmium red also provided by United Mineral, and 0.146 percent lampblack provided by TCR Industries. This formulation provides a pigment color of beige. Other formulations may be used. Changes in the resin mix and/or the pigment formula may

result in different extrusion temperatures in a manner known in the art.

(0060) A finished injected piece 80 is shown in FIG. 8. This injected piece 80 is machined in a manner known in the art so as to clean the outer edges and to shape the gaming chip 20 to a standard diameter of 39 millimeters. A printed inlay, such as the printed inlay 26, may then be positioned over the center part of each side of the injected piece in a manner known in the art. This printed inlay 26 covers holes 62 in the body piece 52 that were formed by the support posts 58. Thus, in an embodiment, all that is visible in the completed gaming chip is the printed inlay 26, the outer ring 22, and the edge spots 24.

(0061) In an embodiment, as described above, the polymer material used in the initial injection process to form the body piece 52 is nylon with a barium additive (barium sulfate) . Barium additive adds weight to the gaming chip 20, so that the gaming chip may be formed to a desired weight, such as between 9 and 11.5 grams. Nylon and a barium additive may also be used in the outer polymer material that makes the outer ring 22, or only nylon may be used for that injection mold. Other materials may be used, including, but not limited to, acrylonitrile-butadiene- styrene (ABS) plastic.

(0062) The injection molding process described

herein, with the RFID inlay 32 is a relatively simple process for forming a gaming chip 20 including a RFID inlay. Injection molding is available directly around the RFID inlay 32, without an intermediate element having to be installed on or around the RFID inlay. Thus, a step in the manufacturing process is eliminated.

(0063) Injection molding the polymer material around the RFID inlay 32 while the RFID inlay 32 is maintained in the middle of a mold cavity equalizes molding pressures on opposite sides of the RFID inlay during the injection and cooling processes. Thus, cupping and warping of the RFID inlay 32 and the gaming chip 20 is prevented or limited so that the gaming chip 20 that is produced is flat. Thus, the gaming chip 20 stacks and stores in a manner desired in the casino industry. In addition, the centered RFID inlay 32 is positioned so that it may be read consistently from opposite sides of the gaming chip 20.

(0064) The fabrication process of the gaming chip 20 described above provides both physical and electronic security for the chip. Physical security is provided in that removing the RFID inlay 32 would destroy the gaming chip 20, and likely the RFID inlay 32. In addition, the RFID device on the RFID inlay 32 may include an electronic security system, such as a security algorithm. An example would be the one time password system described in PCT

Application No. WO/2005/125078, titled "A Network Security Enforcement System," with a publication of December 29, 2005, and incorporated herein by reference.

(0065) Other variations are within the spirit of the present invention. Thus, while the invention is susceptible to various modifications and alternative constructions, a certain illustrated embodiment thereof is shown in the drawings and has been described above in detail. It should be understood, however, that there is no intention to limit the invention to the specific form or forms disclosed, but on the contrary, the intention is to cover all modifications, alternative constructions, and equivalents falling within the spirit and scope of the invention, as defined in the appended claims.

(0066) All references, including publications, patent applications, and patents, cited herein are hereby incorporated by reference to the same extent as if each reference were individually and specifically indicated to be incorporated by reference and were set forth in its entirety herein .

(0067) The use of the terms "a" and "an" and "the" and similar referents in the context of describing the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly

contradicted by context. The terms "comprising," "having," "including, " and "containing" are to be construed as open- ended terms (i.e., meaning "including, but not limited to,") unless otherwise noted. The term "connected" is to be construed as partly or wholly contained within, attached to, or joined together, even if there is something intervening. Recitation of ranges of values herein are merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if it were individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., "such as") provided herein, is intended merely to better illuminate embodiments of the invention and does not pose a limitation on the scope of the invention unless otherwise claimed. No language in the specification should be construed as indicating any non-claimed element as essential to the practice of the invention.

(0068) Preferred embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention. Variations of those preferred embodiments may become apparent to those of

ordinary skill in the art upon reading the foregoing description. The inventors expect skilled artisans to employ such variations as appropriate, and the inventors intend for the invention to be practiced otherwise than as specifically described herein. Accordingly, this invention includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law. Moreover, any combination of the above- described elements in all possible variations thereof is encompassed by the invention unless otherwise indicated herein or otherwise clearly contradicted by context.