Title:
GAS ADSORPTION LAMINATE FOR PACKAGING LIQUID CONTENTS
Document Type and Number:
WIPO Patent Application WO/2021/200894
Kind Code:
A1
Abstract:
The present invention aims to provide: a laminate having excellent pinhole resistance, drop resistance, and water-leakage resistance during storage and transportation vibration and excellent easy needle penetration characteristics at the start of use, as a result of having excellent film-formation and similar manufacturing suitability, filling machine suitability, wrinkle-formation resistance, and printability, exhibiting a high gas adsorption effect and odor-change resistance over the long term, and having excellent seal strength and slidability (low friction properties); and a packaging material and a packaging that use said laminate. The laminate for packaging liquid contents has an easy-pierce sealant layer on one surface thereof and a gas adsorption sealant layer on the other surface thereof. The easy-pierce sealant layer contains an easy-pierce polyethylene and a flexibility-imparting resin. The gas adsorption sealant layer contains a low-elution polyethylene, the flexibility-imparting resin, and a gas adsorbent. The concentration of eluting TOC in the low-elution polyethylene is 1.5–250 ppm. The layer thickness ratio for the easy-pierce sealant layer/gas adsorption sealant layer is 0.3–0.8. The gas adsorbent contains a hydrophobic zeolite.
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Inventors:
TAKEUCHI NAOYA (JP)
SUZUKI YOSHIHIKO (JP)
YONEMOTO TOMOHIRO (JP)
SUZUKI YOSHIHIKO (JP)
YONEMOTO TOMOHIRO (JP)
Application Number:
PCT/JP2021/013451
Publication Date:
October 07, 2021
Filing Date:
March 30, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B27/32; B32B27/00; B65D65/40; B65D77/06
Domestic Patent References:
| WO2019065938A1 | 2019-04-04 |
Foreign References:
| JPH05330560A | 1993-12-14 | |||
| JP2015168466A | 2015-09-28 | |||
| JP2013018504A | 2013-01-31 | |||
| JPH10119207A | 1998-05-12 | |||
| JP2018115011A | 2018-07-26 |
Attorney, Agent or Firm:
YUITA, Junji et al. (JP)
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