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Patent Searching and Data


Title:
GAS BARRIER COMPOSITE FILM FOR HYDROTHERMALLY PROCESSABLE PACKAGE AND PACKAGING BAG OBTAINED BY USING SAME
Document Type and Number:
WIPO Patent Application WO/2007/023856
Kind Code:
A1
Abstract:
Disclosed is a gas barrier composite film for hydrothermally processable packages which is characterized in that at least one gas barrier layer containing a gas barrier resin and an inorganic lamellar compound is interposed between a base film layer and a sealing material layer, and an adhesive layer is formed on both sides of the gas barrier layer by applying an adhesive composition which contains a base material mainly containing a polyurethane resin having at least one functional group selected from the group consisting of an amino group, a hydroxyl group and a carboxyl group, an isocyanate curing agent and an epoxy curing agent at the following functional group ratio: I/P = 0.3-30.0 E/P = 1.5-25.0 (wherein P represents the total number of moles of primary and secondary amino groups, hydroxyl groups and carboxyl groups contained in the base material, I represents the number of moles of isocyanate groups contained in the isocyanate curing agent, and E represents the number of moles of epoxy groups contained in the epoxy curing agent).

Inventors:
YOSHIDA JUNICHI (JP)
MATSUOKA YUTAKA (JP)
UENO YOSHIAKI (JP)
KANO MASANORI (JP)
Application Number:
PCT/JP2006/316503
Publication Date:
March 01, 2007
Filing Date:
August 23, 2006
Export Citation:
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Assignee:
SAKATA INX CORP (JP)
YOSHIDA JUNICHI (JP)
MATSUOKA YUTAKA (JP)
UENO YOSHIAKI (JP)
KANO MASANORI (JP)
International Classes:
B32B27/40; B32B27/00; B65D30/02; B65D65/40; B65D81/34; C08G18/50; C08G59/40; C09J163/00; C09J175/04
Domestic Patent References:
WO2004022485A12004-03-18
Foreign References:
JP2004322602A2004-11-18
JPH0625636A1994-02-01
JPH08283690A1996-10-29
JP2003276124A2003-09-30
JPS6443554A1989-02-15
JP2001335771A2001-12-04
JPH07196764A1995-08-01
Attorney, Agent or Firm:
YASUTOMI, Yasuo (5-36 Miyahara, 3-chome, Yodogawa-k, Osaka-shi Osaka 03, JP)
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