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Title:
GAS BARRIER FILM AND METHOD FOR PRODUCING GAS BARRIER FILM
Document Type and Number:
WIPO Patent Application WO/2018/211850
Kind Code:
A1
Abstract:
Provided are: a gas barrier film comprising an inorganic layer, the gas barrier film exhibiting high adhesiveness between the inorganic layer and an adhesive layer and having high light transmittance; and a method for producing the gas barrier film. The gas barrier film comprises a support, an inorganic layer stacked on one surface of the support, an adhesive layer staked on the surface of the inorganic layer, and a resin layer stacked on the surface of the adhesive layer, in this order, wherein the thickness of the adhesive layer is 15 μm or less and the adhesiveness between the inorganic layer and the adhesive layer is 21-60 N/25 mm. The method for producing the gas barrier film comprises an inorganic layer formation step and a laminating step that are performed in a vacuum environment.

Inventors:
IWASE EIJIRO (JP)
Application Number:
PCT/JP2018/014531
Publication Date:
November 22, 2018
Filing Date:
April 05, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B9/00; B32B27/00; C09K3/10; C23C16/42
Foreign References:
JPH071642A1995-01-06
JP2016204461A2016-12-08
JP2013533819A2013-08-29
JP2012076287A2012-04-19
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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