GAS BARRIER FILM - MITSUBISHI GAS CHEMICAL CO

Title:

GAS BARRIER FILM

Document Type and Number:

WIPO Patent Application WO/2018/105282

Kind Code:

A1

Abstract:

Provided is a gas barrier film which comprises a resin cured layer and a base material film having an inorganic deposition layer, and wherein: the gas barrier film has the resin cured layer on the inorganic deposition layer-side surface of the base material film; the resin cured layer is a cured product of an epoxy resin composition that contains an epoxy resin, an epoxy resin curing agent and non-spherical inorganic particles; and the epoxy resin curing agent is a reaction product of the compounds (A) and (B) described below. Also provided is a laminate which comprises this gas barrier film. (A) at least one compound selected from the group consisting of meta-xylylenediamine and para-xylylenediamine (B) at least one compound selected from the group consisting of predetermined unsaturated carboxylic acids and derivatives thereof

Inventors:

KOUNO KAZUKI (JP)

Application Number:

PCT/JP2017/039749

Publication Date:

June 14, 2018

Filing Date:

November 02, 2017

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)

International Classes:

B32B9/00; B32B27/38; B65D65/40; C08J7/043; C08J7/048; C08L63/00

Domestic Patent References:

WO2013161480A1	2013-10-31
WO2013161481A1	2013-10-31

Foreign References:

JP2009101684A	2009-05-14
JP2010012769A	2010-01-21
JP2003300271A	2003-10-21
JP2004026880A	2004-01-29
JP2012076291A	2012-04-19
JP2016097596A	2016-05-30
JPS4730640Y1	1972-09-13
JP2004277484A	2004-10-07
JP2003300271A	2003-10-21
JP2005028835A	2005-02-03
JP2009101684A	2009-05-14
JP2016097596A	2016-05-30

Other References: