Title:
GAS BARRIER LAMINATED BODY, METHOD FOR PRODUCING SAME, MEMBER FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/186694
Kind Code:
A1
Abstract:
The present invention provides: a gas barrier laminated body having a base unit that has a substrate and a reforming promotion layer, and a gas barrier layer formed on the reforming promotion layer side of the substrate unit, wherein the gas barrier laminated body is characterized in that the elastic modulus of the reforming promotion layer at 23°C is less than 30 GPa, the moisture vapor transmission rate at a substrate unit temperature of 40°C and relative humidity of 90% is no more than 1.0 g/(m2⋅day), and the gas barrier layer is formed by carrying out a reforming process on the surface of a layer containing a polysilazane compound formed on the reforming promotion layer side of the substrate unit; a method for producing the same; a member for an electronic device comprising the gas barrier laminated body; and an electronic device provided with this member for an electronic device. According to the present invention, there is provided a gas barrier laminated body having exceptional gas barrier properties and flex resistance.
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Inventors:
MIMURA TOSHIFUMI (JP)
SUZUKI YUUTA (JP)
NAGANAWA SATOSHI (JP)
SUZUKI YUUTA (JP)
NAGANAWA SATOSHI (JP)
Application Number:
PCT/JP2015/065871
Publication Date:
December 10, 2015
Filing Date:
June 02, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B7/02; B32B9/00; C08J7/043; C08J7/048
Domestic Patent References:
| WO2012014653A1 | 2012-02-02 |
Foreign References:
| JPH08281861A | 1996-10-29 | |||
| JP2008132643A | 2008-06-12 | |||
| JP2012061671A | 2012-03-29 |
Other References:
See also references of EP 3153314A4
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
Haruhito Oishi (JP)
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