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Title:
GAS BARRIER PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/029171
Kind Code:
A1
Abstract:
A gas barrier packaging material which comprises a base material and a resin cured layer, said base material having a surface that is composed of an inorganic material, wherein: the resin cured layer is a cured product of an epoxy resin composition that contains an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound; and the ratio of the molar equivalent of basic nitrogen atoms in the epoxy resin composition to the molar equivalent of acid groups derived from the acidic compound, namely (basic nitrogen atoms)/(acid groups) is from 0.60 to 20.

Inventors:
KOUNO KAZUKI (JP)
HASHIMOTO RYOMA (JP)
Application Number:
PCT/JP2020/027177
Publication Date:
February 18, 2021
Filing Date:
July 13, 2020
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B65D65/40; B32B9/00; B32B27/38; B65D75/00
Domestic Patent References:
WO2018105282A12018-06-14
WO2013161481A12013-10-31
WO2018105282A12018-06-14
Foreign References:
JP2005002353A2005-01-06
JP2007126627A2007-05-24
JP2010202753A2010-09-16
JP2003300271A2003-10-21
JP2005028835A2005-02-03
JP2009101684A2009-05-14
JP2010202753A2010-09-16
JP2013203023A2013-10-07
Other References:
See also references of EP 4015409A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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