Title:
GAS SENSOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2016/085179
Kind Code:
A1
Abstract:
An embodiment of the present invention may provide a gas sensor package comprising: an insulating substrate; a metal layer on one surface of the insulating substrate; a stepped part disposed in the metal layer so as to separate the metal layer into a plurality of pieces; and a gas sensor chip mounted on the stepped part in the metal layer and including a sensing unit, wherein the stepped part has a width which is equal to or smaller than the spacing between two adjacent electrode terminals among a plurality of electrode terminals of the gas sensor chip.
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Inventors:
PAIK JEE HEUM (KR)
HWANG JI HUN (KR)
HWANG JI HUN (KR)
Application Number:
PCT/KR2015/012309
Publication Date:
June 02, 2016
Filing Date:
November 17, 2015
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L29/08; G01N27/12
Foreign References:
| KR100643682B1 | 2006-11-10 | |||
| KR20060096517A | 2006-09-12 | |||
| JP2007064865A | 2007-03-15 | |||
| KR20020060694A | 2002-07-18 | |||
| JP2012098233A | 2012-05-24 |
Attorney, Agent or Firm:
KIM, IN HAN (KR)
김인한 (KR)
김인한 (KR)
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