Title:
GEL FOR GEL NAIL, AND GEL NAIL KIT
Document Type and Number:
WIPO Patent Application WO/2011/074101
Kind Code:
A1
Abstract:
Disclosed is a gel which can be removed by a remover that causes milder physical damage than at least acetone.
Specifically disclosed is a gel for a gel nail, which can be applied on a nail and can be cured by irradiation with light. The gel comprises a styrene monomer that can be polymerized by irradiation with light and a photopolymerization initiator. The styrene monomer has a similar structural formula to that of limonene which is used as a remover. Therefore, a polystyrene produced by curing the styrene monomer can be dissolved in limonene.
Inventors:
KAWAGUCHI Tunetaka (23-36, Saganoarisugawacho Ukyo-k, Kyoto-shi Kyoto 16, 〒6168316, JP)
Application Number:
JP2009/071060
Publication Date:
June 23, 2011
Filing Date:
December 17, 2009
Export Citation:
Assignee:
RIVERBOND CO., LTD. (18-2, Toumeicho 5-chome Chikusa-k, Nogoya-shi Aichi 28, 〒4640028, JP)
リバーボンド株式会社 (〒28 愛知県名古屋市千種区東明町5丁目18-2 Aichi, 〒4640028, JP)
リバーボンド株式会社 (〒28 愛知県名古屋市千種区東明町5丁目18-2 Aichi, 〒4640028, JP)
International Classes:
A61K8/31; A45D31/00; A61K8/35; A61Q3/02; A61Q3/04
Attorney, Agent or Firm:
KOJIMA Atsuhi (9F TOHMA TAKADANOBABA 1-2, Takadanobaba 2-chome Shinjuku-ku Tokyo, 75, 〒1690075, JP)
Previous Patent: FIXING BRACKET FOR SOLAR CELL MODULE
Next Patent: MEASUREMENT SYSTEM, AND IMAGE FORMING METHOD AND PROGRAM
Next Patent: MEASUREMENT SYSTEM, AND IMAGE FORMING METHOD AND PROGRAM
