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Title:
GETTERING LAYER FORMING DEVICE, GETTERING LAYER FORMING METHOD, AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2018/221290
Kind Code:
A1
Abstract:
A gettering layer forming device for forming a gettering layer on a substrate has: a substrate holding part that holds the substrate; a lapping film that contacts the substrate held in the substrate holding part and polishes said substrate; a base that supports the lapping film, and is capable of moving in the vertical direction and rotating; and a water supply unit that supplies water to the substrate held in the substrate holding part.

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Inventors:
FUKUOKA TETSUO (JP)
Application Number:
PCT/JP2018/019481
Publication Date:
December 06, 2018
Filing Date:
May 21, 2018
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; H01L21/322
Foreign References:
JP2013247132A2013-12-09
JP2013026613A2013-02-04
JP2010251542A2010-11-04
JP2013516328A2013-05-13
JP2007242902A2007-09-20
JP2002057130A2002-02-22
JP2002224946A2002-08-13
JP2008117844A2008-05-22
JP2006346821A2006-12-28
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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