GLASS CORE WIRING SUBSTRATE WITH BUILT-IN HIGH-FREQUENCY FILTER, HIGH-FREQUENCY MODULE IN WHICH SAID GLASS CORE WIRING SUBSTRATE WITH BUILT-IN HIGH-FREQUENCY FILTER IS USED, AND METHOD FOR MANUFACTURING GLASS CORE WIRING SUBSTRATE WITH BUILT-IN HIGH-FREQUENCY FILTER

WIPO Patent Application WO/2021/205986

A1

Provided are: a glass core wiring substrate with a built-in high-frequency filter in which a glass substrate with excellent high-frequency characteristics is used as a core material, and which promotes the efficient placement of a conductor within the glass substrate; a module in which said glass core wiring substrate with a built-in high-frequency filter is used; and a method for manufacturing a glass core wiring substrate with a built-in high-frequency filter. The structure is such that in forming of an electrically conductive layer inside a glass through hole 4 of a glass core substrate 1, there are formed a hollow tubular conductor layer formed on a side wall, and a lid-shaped conductor layer made to cover one of two openings, the hollow tubular conductor layer and the lid-shaped conductor layer being connected. As one means for realizing this structure, a carrier 15 is affixed to one surface of the glass core substrate 1 so as to shield one side of the opening of the glass through hole 4, and after lamination of a conductor, the carrier 15 is peeled and removed.

MANIWA SUSUMU (JP)

PCT/JP2021/014189

October 14, 2021

April 01, 2021

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TOPPAN INC (JP)

H01F17/00; H01F27/00; H01L23/12; H05K1/16; H05K3/46

WO2019225698A1

2019-11-28

JP2014165362A	2014-09-08
JP2016527743A	2016-09-08
JP2016096262A	2016-05-26

Patent Corporate Body Dai-ichi Kokusai Tokkyo Jimusho (JP)

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