Title:
GLASS CUTTING APPARATUS, GLASS SUBSTRATE DISASSEMBLING APPARATUS, GLASS SUBSTRATE DISASSEMBLING SYSTEM, GLASS CUTTING METHOD AND GLASS SUBSTRATE DISASSEMBLING METHOD
Document Type and Number:
WIPO Patent Application WO/2008/047622
Kind Code:
A1
Abstract:
A glass cutting apparatus (101) is provided with a pair of cutters (13a, 13b) arranged to
face each other by holding a glass surface in the vertical direction and sandwiching a
glass substrate; a first pressing means (14a) for pressing one of the cutters from
a direction horizontal to one of the glass substrate surfaces with a pressing force
(P); a second pressing means (14b), which is arranged to face the first pressing means,
for pressing the other cutter from a direction horizontal to the other glass substrate
surface with the pressing force (P); and a shifting means (20) for shifting, at
the same time, the pair of cutters which are pressing the glass substrate with
the pressing force (P).
Inventors:
IWAMOTO, Hiroshi (())
岩本 洋 (())
TANI, Yoshiyuki (())
谷 美幸 (())
岩本 洋 (())
TANI, Yoshiyuki (())
谷 美幸 (())
Application Number:
JP2007/069592
Publication Date:
April 24, 2008
Filing Date:
October 05, 2007
Export Citation:
Assignee:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 5718501, JP)
松下電器産業株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 5718501, JP)
IWAMOTO, Hiroshi (())
岩本 洋 (())
TANI, Yoshiyuki (())
松下電器産業株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 5718501, JP)
IWAMOTO, Hiroshi (())
岩本 洋 (())
TANI, Yoshiyuki (())
International Classes:
C03B33/02; B28D5/00; C03B33/07; G02F1/1333; H01J9/50; H01J11/02
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (AOYAMA & PARTNERS, IMP Building 3-7, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, 5400001, JP)