Title:
GLASS-EMBEDDED SILICON SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/102291
Kind Code:
A1
Abstract:
A method for manufacturing a glass-embedded silicon substrate, the method comprising: a step for forming a recess (11) in a silicon substrate (10); a step for filling the recess (11) with a glass material (20a) in the form of a powder, a paste, or a precursor solution; a step for heating and softening the glass material (20a); a step for sintering the softened glass material (20a); and a step for exposing the glass material (20a) and the silicon substrate (10) on the front and back surfaces of the silicon substrate (10) where the recess (11) is filled with the glass material (20a).
Inventors:
OKUMURA SHIN
TAURA TAKUMI
NAKATANI TOMOHIRO
TOMOIDA RYO
TAURA TAKUMI
NAKATANI TOMOHIRO
TOMOIDA RYO
Application Number:
PCT/JP2012/051505
Publication Date:
August 02, 2012
Filing Date:
January 25, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
OKUMURA SHIN
TAURA TAKUMI
NAKATANI TOMOHIRO
TOMOIDA RYO
OKUMURA SHIN
TAURA TAKUMI
NAKATANI TOMOHIRO
TOMOIDA RYO
International Classes:
H01L23/02; C03C27/04; G01P15/08; G01P15/125; H01L23/06; H01L23/08; H01L23/14; H01L29/84
Foreign References:
| JP2002043468A | 2002-02-08 | |||
| JPH10144974A | 1998-05-29 | |||
| JPS63215057A | 1988-09-07 |
Attorney, Agent or Firm:
ITO, Masakazu et al. (JP)
Masakazu Ito (JP)
Masakazu Ito (JP)
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Claims: