Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
GLASS FILM CUTTING METHOD, GLASS ROLL PRODUCTION METHOD, AND GLASS FILM CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/011445
Kind Code:
A1
Abstract:
Disclosed is a glass film cutting device (1) that uses thermal stress generated by local heating and cooling of the heated area along a planned cutting line (7) in a glass film (G) to move an initial crack (10) formed in the end section of the planned cutting line (7) forward along the planned cutting line (7). The glass film cutting device (1) positions a resin sheet (R) that is more flexible than the glass film (G) in the cutting area and blows air from a levitation means (3) on to the bottom surface of the resin sheet (R) to levitate said resin sheet. The glass film cutting device (1) then covers and holds up and supports the planned cutting area, which includes the planned cutting line (7) in the glass film (G), with the levitated resin sheet (R) and, in this state, cuts the glass film (G).

Inventors:
TERANISHI YASUO (JP)
MATSUMOTO YASUHIRO (JP)
MINARI TAIKI (JP)
FURUTA TAKAYA (JP)
Application Number:
PCT/JP2011/066241
Publication Date:
January 26, 2012
Filing Date:
July 15, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
TERANISHI YASUO (JP)
MATSUMOTO YASUHIRO (JP)
MINARI TAIKI (JP)
FURUTA TAKAYA (JP)
International Classes:
C03B33/033; B23K26/10; B23K26/38; B23K26/40; B28D5/00; C03B33/09
Foreign References:
JP2007246298A2007-09-27
JP2005212364A2005-08-11
JP2007090860A2007-04-12
JP2004182530A2004-07-02
JP2007191363A2007-08-02
JP2010105900A2010-05-13
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
Kunihiko Shiromura (JP)
Download PDF:
View/Download PDF      PDF Help
Claims:



 
Previous Patent: β-TYPE SIALON, PROCESS FOR PRODUCTION OF β-TYPE SIALON, AND LIGHT-EMITTING DEVICE

Next Patent: LASER PROCESSING METHOD