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Patent Searching and Data


Title:
GLASS FILM CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/065248
Kind Code:
A1
Abstract:
After forming an initial crack (3) in a portion of the planned cutting line (2) of the glass film (1), in a state in which one surface of the glass film (1) is supported on a support member (5), the glass film (1) is flexed such that the other surface of the glass film (1) becomes convex, and by thusly applying tensile stress to the planned cutting line (2), the initial crack (3) is developed along the planned cutting line (2), and the glass film (1) is cut.

Inventors:
FUJII TAKAHIDE (JP)
Application Number:
PCT/JP2013/078510
Publication Date:
May 01, 2014
Filing Date:
October 22, 2013
Export Citation:
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Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
C03B33/033; B28D5/00; C03B33/037; H01L51/50; H05B33/02; H05B33/10
Domestic Patent References:
WO2011155314A12011-12-15
Foreign References:
JP2011121791A2011-06-23
JPH0952725A1997-02-25
JPH01292313A1989-11-24
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
Kunihiko Shiromura (JP)
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