Title:
GLASS MEMBER WITH SEAL-BONDING MATERIAL LAYER AND METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2010/071176
Kind Code:
A1
Abstract:
Seal-bonding properties and reliability of an electronic device are improved by increasing bonding strength to a glass substrate with good reproducibility during laser seal-bonding.
A glass substrate (3) has a sealing region. The sealing region is provided with a seal-bonding material layer (5) that is a fired layer of a seal-bonding glass material containing a seal-bonding glass, a low expansion filler and a laser absorbent. The seal-bonding glass contains, on a mass basis, 20-68% of SnO, 0.5-5% of SnO2 and 20-40% of P2O5. The seal-bonding material layer (5) has a residual carbon content of 20-1,000 ppm on a mass basis. The glass substrate (3) and a glass substrate (2) having an element formation region that is provided with an electronic element are stacked together, and the seal-bonding material layer (5) is melted by irradiation of laser light (6), so that the substrates (2, 3) are seal-bonded with each other.
Inventors:
KAWANAMI SOHEI (JP)
Application Number:
PCT/JP2009/071045
Publication Date:
June 24, 2010
Filing Date:
December 17, 2009
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
KAWANAMI SOHEI (JP)
KAWANAMI SOHEI (JP)
International Classes:
C03C8/08; C03C27/06; C03C8/24; G02F1/1339; G09F9/30; H01J9/26; H01L51/50; H05B33/04; H05B33/10
Foreign References:
| JP2006524419A | 2006-10-26 | |||
| JP2008059802A | 2008-03-13 | |||
| JP2003146691A | 2003-05-21 | |||
| JP2008037740A | 2008-02-21 | |||
| JP2002020137A | 2002-01-23 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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