GLASS MEMBER WITH SEALING MATERIAL LAYER, ELECTRONIC DEVICE USING SAME AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2012/090943

A1

Provided is a glass member with a sealing material layer which is capable of suppressing generation of flaws such as cracks, fissures, etc. in a glass substrate or a sealing layer when narrowing the space between two glass substrates, and improving the sealing properties between the glass substrates and the reliability thereof. A glass substrate (3) comprises a surface (3a) which is provided with a sealing area. A sealing material layer (9) having a thickness of less than 7 μm is formed on the sealing area of the glass substrate (3). The sealing material layer (9) comprises a sealing glass and an inorganic filling material containing a laser absorbing material, and is composed of a calcined layer of a glass material for sealing in which the content of the inorganic filling material is 2-44 volume%. The surface area of the inorganic filling material in the glass material for sealing is in the range of over 6 m2/cm3 and less than 14 m2/cm3. The difference between a coefficient of thermal expansion α1 of the sealing material layer (9) and a coefficient of thermal expansion α2 of the glass substrate (3) is within the range of 15-70 (x 10-7/C°).

KAWANAMI SOHEI (JP)

PCT/JP2011/080092

July 05, 2012

December 26, 2011

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ASAHI GLASS CO LTD (JP)
KAWANAMI SOHEI (JP)

C03C27/06; C03C8/24; H01L31/042; H01L51/50; H05B33/04; H05B33/10

WO2010071176A1	2010-06-24
WO2010061853A1	2010-06-03
WO2010128679A1	2010-11-11

SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)

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