Title:
GLASS PLATE CUTTING METHOD, GLASS PLATE CUTTING DEVICE, AND METHOD FOR MANUFACTURING CUT GLASS PLATE
Document Type and Number:
WIPO Patent Application WO/2017/002656
Kind Code:
A1
Abstract:
Disclosed is a method for cutting a glass plate through fold-cutting, characterized by comprising: a step for generating an initial crack at an edge section of the glass plate on a planned cutting line; a step for emitting and linearly collecting infrared light on the planned cutting line including the initial crack by using an infrared ray linear heater, and for heating a planned cutting surface by the infrared light that passes through the glass plate; a step for cooling the vicinity of the crack on the planned cutting line after the heating step and forming a spread crack by spreading the initial crack along the planned cutting line; and a step for forming a cutting line crack by causing the spread crack to progress to the end point of the planned cutting line, and performing fold-cutting along the cutting line crack. This method for cutting a glass plate through fold-cutting is excellent in linearity and can perform cutting even on a glass plate having residual stress while maintaining a fine cutting rate.
Inventors:
TAMON HIROYUKI (JP)
Application Number:
PCT/JP2016/068319
Publication Date:
January 05, 2017
Filing Date:
June 21, 2016
Export Citation:
Assignee:
CENTRAL GLASS CO LTD (JP)
International Classes:
C03B33/09; B28D5/00; C03B33/033
Domestic Patent References:
| WO2016125609A1 | 2016-08-11 |
Foreign References:
| JP2002100590A | 2002-04-05 | |||
| JP2015044729A | 2015-03-12 | |||
| JP2015511572A | 2015-04-20 |
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (JP)
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