Title:
GLASS PLATE MACHINING METHOD AND GLASS PLATE MACHINING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/092736
Kind Code:
A1
Abstract:
A first rotating suction pad device (4A) and a second rotating suction pad device (4B) are installed in a glass plate machining apparatus (1), said first rotating suction pad device (4A) moving between a first glass plate insertion area (S1) and a grinding area (23), and said second rotating suction pad device (4B) moving between a second glass plate insertion area (S2) and the grinding area (23). The first rotating suction pad device (4A) and the second rotating suction pad device (4B) are both installed in such a way as to alternately move into the grinding area (23).
Inventors:
BANDO, Kazuaki (4-60, Kanazawa 2-chome, Tokushima-sh, Tokushima 71, 〒7700871, JP)
Application Number:
JP2010/000474
Publication Date:
August 04, 2011
Filing Date:
January 27, 2010
Export Citation:
Assignee:
BANDO KIKO CO., LTD. (4-60, Kanazawa 2-chome Tokushima-sh, Tokushima 71, 〒7700871, JP)
坂東機工株式会社 (〒71 徳島県徳島市金沢２丁目４番６０号 Tokushima, 〒7700871, JP)
坂東機工株式会社 (〒71 徳島県徳島市金沢２丁目４番６０号 Tokushima, 〒7700871, JP)
International Classes:
B24B9/10; B24B9/00
Attorney, Agent or Firm:
TAKADA, Takeshi (3rd Floor, Zenkaren Building 12-4, Minamiaoyama 5-chome, Minato-k, Tokyo 62, 〒1070062, JP)
Download PDF:
Claims: