Title:
GLASS PLATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/111158
Kind Code:
A1
Abstract:
The present invention addresses the technical problem of contributing to the densification of semiconductor packages by providing: a glass plate that is suitable for supporting a processed substrate used in high-density wiring and has a high end-surface strength; and a manufacturing method for the glass plate. This glass plate is characterized in that the thickness deviation of the entire plate is less than 2.0 μm, and all or a portion of an end surface of the glass plate is a melt-solidified surface.
Inventors:
KATAYAMA HIROKI (JP)
NAKAJIMA HIROSHI (JP)
NAKAJIMA HIROSHI (JP)
Application Number:
PCT/JP2015/085678
Publication Date:
July 14, 2016
Filing Date:
December 21, 2015
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
C03B29/02; C03C19/00; H01L23/12; H01L23/15
Domestic Patent References:
| WO2013099676A1 | 2013-07-04 | |||
| WO2015037478A1 | 2015-03-19 | |||
| WO2015156075A1 | 2015-10-15 |
Foreign References:
| JP2011016705A | 2011-01-27 | |||
| JP2012238894A | 2012-12-06 |
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
Kunihiko Shiromura (JP)
Kunihiko Shiromura (JP)
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