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Patent Searching and Data


Title:
GLASS PLATE MODULE
Document Type and Number:
WIPO Patent Application WO/2017/014248
Kind Code:
A1
Abstract:
A glass plate module is provided with: a glass plate (1); a conductive layer (21) laminated on the glass plate (1); a plurality of conductive cables (52) that extend from a plurality of connectors or from a single connector; a plurality of connection terminals (3) that are positioned above the conductive layer with a space therebetween, are connected to the conductive cables, and are formed from a conductive material; lead-free solder (4) that secures the connection terminals (3) to the conductive layer (21); and a binding member (53) that binds the plurality of conductive cables (52) between the connector(s) and the connection terminals.

Inventors:
TOKIWA JUNICHI (JP)
Application Number:
PCT/JP2016/071328
Publication Date:
January 26, 2017
Filing Date:
July 20, 2016
Export Citation:
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Assignee:
NIPPON SHEET GLASS CO LTD (JP)
International Classes:
H01R4/02; B60S1/02; C03C17/06; H01R12/51; H05K3/34
Foreign References:
JP3957302B22007-08-15
JP2015003602A2015-01-08
JP3175404U2012-05-10
JPS5678169U1981-06-25
Other References:
See also references of EP 3327866A4
Attorney, Agent or Firm:
TACHIBANA, Kenji et al. (JP)
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