Title:
GLASS PLATE MODULE
Document Type and Number:
WIPO Patent Application WO/2020/162354
Kind Code:
A1
Abstract:
The glass plate module according to the present invention is provided with: a glass body; a conductive body layered on the glass body; at least one connection terminal which is fixed to the conductive layer and which is formed of an electrically conductive material; a lead-free solder for fixing the connection terminal to the conductive layer. The connection terminal is provided with: a base; at least one placement part which is linked to the base and which is fixed to the conductive layer through the lead-free solder; a power supply part which is linked to the base and to which a cable for supplying power to the conductive layer is connected; and a connection part that is disposed between the base and the connection part and that connects the connection part to the base in a bendable manner.
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Inventors:
YOSHIDA MINORU (JP)
TOKIWA JUNICHI (JP)
TOKIWA JUNICHI (JP)
Application Number:
PCT/JP2020/003675
Publication Date:
August 13, 2020
Filing Date:
January 31, 2020
Export Citation:
Assignee:
NIPPON SHEET GLASS CO LTD (JP)
International Classes:
B23K1/00; C03C17/06; H01Q1/22; H01R4/02; H01R4/18; H05B3/02; H05B3/84; H05K1/18; B60J1/00; B60S1/02
Domestic Patent References:
| WO2016204247A1 | 2016-12-22 |
Foreign References:
| US20040237302A1 | 2004-12-02 | |||
| JPH07132781A | 1995-05-23 | |||
| JP2018537697A | 2018-12-20 | |||
| JP2010500703A | 2010-01-07 | |||
| JP2016064444A | 2016-04-28 | |||
| JP2017022047A | 2017-01-26 | |||
| JPS5622075A | 1981-03-02 | |||
| JPS57197761A | 1982-12-04 | |||
| JP2019212494A | 2019-12-12 | |||
| JP2014519149A | 2014-08-07 |
Other References:
See also references of EP 3922392A4
Attorney, Agent or Firm:
TACHIBANA, Kenji et al. (JP)
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