Title:
GLASS SUBSTRATE HAVING SILICON WIRING EMBEDDED THEREIN AND METHOD FOR MANUFACTURING THE GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/118785
Kind Code:
A1
Abstract:
Disclosed is a glass substrate having silicon wiring embedded therein, wherein the area from which the silicon wiring is to be led out can be discretionary set. Also disclosed is a method for manufacturing such glass substrate.
The glass substrate having the silicon wiring embedded therein has a first main surface and a second main surface, which face each other, and side surfaces, and the substrate is provided with a glass base section and the silicon wiring embedded in the glass base section. The silicon wiring is provided with: a first lead out portion exposed from the first main surface; a second lead out portion exposed from the first main surface or the second main surface or one of the side surfaces; and a connecting section that connects between the first lead out portion and the second lead out portion. The first lead out portion and the second lead out portion are disposed at different positions when viewed from the normal line direction of the first main surface.
Inventors:
OKUMURA SHIN (JP)
TAURA TAKUMI (JP)
NAKATANI TOMOHIRO (JP)
TAURA TAKUMI (JP)
NAKATANI TOMOHIRO (JP)
Application Number:
PCT/JP2011/057399
Publication Date:
September 29, 2011
Filing Date:
March 25, 2011
Export Citation:
Assignee:
PANASONIC ELEC WORKS CO LTD (JP)
OKUMURA SHIN (JP)
TAURA TAKUMI (JP)
NAKATANI TOMOHIRO (JP)
OKUMURA SHIN (JP)
TAURA TAKUMI (JP)
NAKATANI TOMOHIRO (JP)
International Classes:
H01L23/15; G01P15/08; G01P15/125
Foreign References:
| JP2002043468A | 2002-02-08 | |||
| JP2006047279A | 2006-02-16 |
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (JP)
Mitsuo Tanaka (JP)
Mitsuo Tanaka (JP)
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Claims:
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