Title:
GLASS SUBSTRATE HEAT-PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/150111
Kind Code:
A1
Abstract:
In this invention, the entirety of a glass substrate 2 having a thickness of 500 μm or less is stacked onto a setter 1, and the glass substrate 2 is heat-processed in this state for the purpose of decreasing the heat-shrinking rate thereof. In this process, for the glass substrate 2, a substrate is used in which the edge portion strength when curved in such a manner that the front surface 2a side is convex and the edge portion strength when curved in such a manner that the back surface 2b side is convex are both 200 MPa or greater.
Inventors:
INAYAMA NAOTOSHI (JP)
KAWAGUCHI TAKAHIRO (JP)
MINARI TAIKI (JP)
WU CHAO-LIN (TW)
CHENG CHIH-WEI (TW)
LU FANG-YEN (TW)
KAWAGUCHI TAKAHIRO (JP)
MINARI TAIKI (JP)
WU CHAO-LIN (TW)
CHENG CHIH-WEI (TW)
LU FANG-YEN (TW)
Application Number:
PCT/JP2017/004556
Publication Date:
September 08, 2017
Filing Date:
February 08, 2017
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
NIPPON ELECTRIC GLASS TAIWAN CO LTD (TW)
NIPPON ELECTRIC GLASS TAIWAN CO LTD (TW)
International Classes:
C03B25/02; B28D5/00; C03B33/033; C03B33/08; B23K26/38
Domestic Patent References:
| WO2012169002A1 | 2012-12-13 |
Foreign References:
| JP2003308792A | 2003-10-31 | |||
| JP2011116611A | 2011-06-16 | |||
| JP2015062927A | 2015-04-09 | |||
| JP2016013928A | 2016-01-28 |
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
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